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Rulon Bearings
Henkel Loctite® ABLESTIK ABP 8420 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black paste

Cure: Heat cure

Product Benefits:

  • Non-conductive
  • Excellent resin bleed out (RBO) Performance
  • Fast cure
  • Black pigmentation for blocking stray light
  • Good adhesion to PA substrates
  • Good reliability performance
Application: Die attach

Key Substrates: Most plastics and Glass

Typical Applications: Cap, diffuser attach in wirebond packages

LOCTITE ABLESTIK ABP 8420 non-conductive adhesive is designed for cap and lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring.

Information provided by Loctite®

Vendors:
Available Properties
  • Brookfield Viscosity, Uncured, CP51, Speed 5 rpm
  • Tensile Modulus, Cured, DMA
  • Tensile Modulus, Cured, DMA
  • Tensile Modulus, Cured, DMA
  • Tensile Modulus, Cured, DMA
  • CTE, linear, Cured, Below Tg
  • CTE, linear, Cured, Above Tg
  • Thermal Conductivity, Cured
  • Glass Transition Temp, Tg, Cured
  • Cure Time, ramp to 150ºC, hold 15 minutes @ 150 °C
  • Cure Time, Alternate Cure Schedule
  • Cure Time, Alternate Cure Schedule
  • Working Life
  • Shelf Life, Uncured, from date of manufacture
  
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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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