CHO-BOND® 1029 is a highly conductive silicone adhesive, intended for bonding Chomerics’ conductive silicone EMI gaskets to electrically conductive substrates. It is a two-component, siliver-plated-copper filled system which cures to a flexible, permanent bond. Unlike 1-part conductive silicone RTV adhesives, its cure can be accelerated with heat. CHO-BOND® 1029 should not be used as an EMI caulk. The material is highly conductive through a bond line of less than 8 mils, but through a bond line of greater thickness, CHO-BOND 1029 electrical conductivity sharply decreases. Information provided by Chomerics |