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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® H67MP-T Thermally Conductive, Electrically Insulating Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes: Preliminary Product Information Sheet

Material Description: A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD 883, Test Method 5011 for hybrid microelectronic packaging and assemblies. It may be used for bonding SMDs, die-attach, substrate-attach or general heat sinking. Meets MIL-STD-883, Method 5011. A thixotropic version of EPO-TEK® H67MP.

Information Provided by Epoxy Technology
Vendors:
Available Properties
  • Specific Gravity
  • Particle Size
  • Viscosity, 0.5 rpm
  • Ionic Impurities - Na (Sodium)
  • Ionic Impurities - K (Potassium)
  • Ionic Impurities - Cl (Chloride)
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
  
Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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Chemically Resistant adhesives



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