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Ensinger PEI
Arlon Electronic Materials 33N Polyimide Laminate and Prepreg
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: High reliability and high temperature material

33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg results in low overall processing and minimizes risk of latent PTH defects in-service.

  • Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachment
  • Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
  • Toughened. Non-MDA chemistry resists drill cracking
  • Compatible with lead-free processing
  • RoHS/WEEE compliant

Typical Applications:

  • PCBs that are subjected to high temperatures during processing, such as lead-free soldering
  • Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors.

Information provided by ARLON Electronic Materials.

Available Properties
  • Density, ASTM D792 Method A
  • Water Absorption, IPC TM-650
  • Modulus of Elasticity, IPC TM-650
  • Poissons Ratio, ASTM D3039
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
  • Peel Strength, IPC TM-650, To Copper (1 oz./35 micron); At Elevated Temperatures
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
  • Volume Resistivity, IPC TM-650, C96/35/90
  • Volume Resistivity, IPC TM-650, E24/125
  • Surface Resistance, IPC TM-650, C96/35/90
  • Surface Resistance, IPC TM-650, E24/125
  • Dielectric Constant, IPC TM-650
  • Dielectric Strength, IPC TM-650
  • Dissipation Factor, IPC TM-650
  • Arc Resistance, IPC TM-650 2.5.1
  • CTE, linear, IPC TM-650 2.4.41
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (< Tg)
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (> Tg)
  • Thermal Conductivity, ASTM E1461
  • Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
  • Decomposition Temperature, IPC TM-650, Onset
  • Decomposition Temperature, IPC TM-650, 5 percent
  • Flammability, UL94
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