Arlon Electronic Materials 33N Polyimide Laminate and Prepreg

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Arlon Electronic Materials 33N Polyimide Laminate and Prepreg
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	High reliability and high temperature material 33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg results in low overall processing and minimizes risk of latent PTH defects in-service. Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachment Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41 Toughened. Non-MDA chemistry resists drill cracking Compatible with lead-free processing RoHS/WEEE compliant Typical Applications: PCBs that are subjected to high temperatures during processing, such as lead-free soldering Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors. Information provided by ARLON Electronic Materials.
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Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Modulus of Elasticity, IPC TM-650 2.4.18.3
Poissons Ratio, ASTM D3039
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Dielectric Constant, IPC TM-650 2.5.5.3
Dielectric Strength, IPC TM-650 2.5.6.2
Dissipation Factor, IPC TM-650 2.5.5.3
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (< Tg)
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (> Tg)
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
Decomposition Temperature, IPC TM-650 2.4.24.6, Onset
Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
Flammability, UL94

Property Data

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Category Notes
Plastic

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