Description: Chomerics’ THERM-A-GAP elastomers are used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing chassis parts to be used as heat spreaders where space is restricted. Pioneered by Chomerics, THERM-A-GAP™ materials are used throughout the world in hundreds of applications where limited air flow, irregular surfaces and/or dense packaging conditions create the need for an efficient heat transfer mechanism. More practical and efficient than potting compounds. THERM-A-GAP™ materials allow the designer to be less concerned with component proximity to heat sinks or heat spreaders. Material Composition: THERM-A-GAP™ materials consist of an extremely soft silicone elastomer loaded with ceramic particles. They are available with aluminum foil, dielectric film, or fiberglass carriers. This material is reinforced with a think, thermally conductive fiberglass reinforced insulator that resists puncture and provides electrical isolation. Six standard thicknesses are available. Pressure-sensitive adhesive on the carrier side is standard.

Product Attributes: Good thermal performance; Most economical; Flat sheets; Light purple.

Information provided by Chomerics