Resinlab® SEC1233 Silver Filled Epoxy Adhesive

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Resinlab® SEC1233 Silver Filled Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. It also can be packaged in small side-by-side dispensing cartridges for use with static mixers. This system is also available in a pre-mix and frozen format. SEC1233 provides exceptionally high conductivity starting immediately after mixing and improves as the curing process proceeds. It also has the additional benefit of very high thermal conductivity due to its high silver loading. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials. Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Vendors:

Available Properties

Specific Gravity, TM R050-16, Mixed
Water Absorption, TM R050-35
Viscosity, Mixed
Hardness, Shore D
Tensile Strength at Break, TM R050-36
Tensile Strength, Ultimate, TM R050-36
Tensile Strength, Yield, TM R050-36
Elongation at Break, TM R050-36
Tensile Modulus, TM R050-36
Compressive Yield Strength, TM R050-38
Compressive Strength, TM R050-38, Ultimate
Compressive Strength, TM R050-38, Break
Compressive Modulus, TM R050-38
Adhesive Bond Strength, Lap Shear-Aluminum
Volume Resistivity
CTE, linear, Below Tg
Thermal Conductivity
Maximum Service Temperature, Air
Minimum Service Temperature, Air
Glass Transition Temp, Tg
Cure Time
Cure Time
Pot Life

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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