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Master Bond adhesives

Rogers Arlon TC350 Thermally Conductive Ceramic Filled PTFE/Woven Fiberglass Laminate
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes: Microwave material for improved thermal management - for microwave printed circuit boards

  • Thermal Conductivity and Dielectric Constant Stability across Wide Temperatures
  • Very Low Loss Tangent provides higher Amplifier or Antenna Efficiency
  • Easier to drill than traditional commercial based laminates utilizing thick and dense style woven glass
  • Priced Affordably for Commercial Applications
  • High Peel Strength for Reliable Copper Adhesion in thermally stressed applications

Benefits:

  • Heat Dissipation and Management
  • Improved Processing and Reliability
  • Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs

Typical Applications:

  • Power Amplifiers, Filters and Couplers
  • Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
  • Thermally Cycled Antennas sensitive to dielectric drift
  • Microwave Combiner and Power Dividers

Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesMetricEnglishComments
Density 2.30 g/cc0.0831 lb/in³ASTM D792 Method A
Water Absorption 0.050 %0.050 %IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss  0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		Water Vapor Recovered; NASA SP-R-0022A
 0.020 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.020 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
Collected Volatile Condensable Material 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 55.2 MPa8000 psiCross; IPC TM-650 2.4.18.3
 75.8 MPa11000 psiMachine; IPC TM-650 2.4.18.3
Flexural Strength 68.9 MPa10000 psiCross; IPC TM-650 2.4.4
 96.5 MPa14000 psiMachine; IPC TM-650 2.4.4
Peel Strength 1.23 kN/m7.00 pliTo Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
 1.23 kN/m7.00 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
 1.58 kN/m9.00 pliTo Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 7.40e+12 ohm-cm7.40e+12 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
 1.40e+14 ohm-cm1.40e+14 ohm-cmE24/125; IPC TM-650 2.5.17.1
Surface Resistance 3.20e+14 ohm3.20e+14 ohmC96/35/90; IPC TM-650 2.5.17.1
 4.30e+14 ohm4.30e+14 ohmE24/125; IPC TM-650 2.5.17.1
Dielectric Constant  3.5
@Frequency 1e+6 Hz		3.5
@Frequency 1e+6 Hz		may vary by thickness; IPC TM-650 2.5.5.3
 3.5
@Frequency 1e+10 Hz		3.5
@Frequency 1e+10 Hz		may vary by thickness; IPC TM-650 2.5.5.5
 3.5
@Frequency 1.80e+9 Hz		3.5
@Frequency 1.80e+9 Hz		may vary by thickness; Resonant Cavity
Dielectric Strength 30.7 kV/mm780 kV/inIPC TM-650 2.5.6.2
Dielectric Breakdown 40000 V40000 VIPC TM-650 2.5.6
Dissipation Factor  0.0015
@Frequency 1e+6 Hz		0.0015
@Frequency 1e+6 Hz		may vary by thickness; IPC TM-650 2.5.5.3
 0.0018
@Frequency 1.80e+9 Hz		0.0018
@Frequency 1.80e+9 Hz		may vary by thickness; Resonant Cavity
 0.0020
@Frequency 1e+10 Hz		0.0020
@Frequency 1e+10 Hz		may vary by thickness; IPC TM-650 2.5.5.5
Arc Resistance >= 240 sec>= 240 secIPC TM-650 2.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear 7.00 µm/m-°C
@Temperature 50.0 - 150 °C		3.89 µin/in-°F
@Temperature 122 - 302 °F		IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 23.0 µm/m-°C
@Temperature 50.0 - 150 °C		12.8 µin/in-°F
@Temperature 122 - 302 °F		z direction; IPC TM-650 2.4.24
Specific Heat Capacity 0.900 J/g-°C0.215 BTU/lb-°FASTM E1461
Thermal Conductivity 1.00 W/m-K6.94 BTU-in/hr-ft²-°FASTM D5470
Decomposition Temperature 520 °C968 °FInitial; IPC TM-650 2.4.24.6
 567 °C1050 °F5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)> 60IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C)-9IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)
Z-Axis Expansion (%)1.2IPC TM-650 2.4.24 (50-260°C)

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