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Master Bond adhesives

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Evonik TEGO® AddBond 2325 Adhesion resin solution
Categories: Other Engineering Material

Material Notes: Special features:
  • particularly for solvent borne formulations
  • good adhesion improvement on metal
  • improves the corrosion protection
  • wide compatibility, particularly with polyacrylates
Application:
  • industrial coatings recommended addition level solid calculated on binder solid: 3.0 - 15.0 %

Information provided by Evonik

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Physical PropertiesOriginal ValueComments
Volatiles 40 %
Viscosity 500 cP
 
Chemical PropertiesOriginal ValueComments
Total Acid Number 18[mg KOH/g], calculated on non-volatile content
 
Optical PropertiesOriginal ValueComments
Gardner Color Number 1.0
 
Descriptive Properties
Hydroxyl Number16 mg KOH/gcalculated on non-volatile content

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PEVONIL666 / 196870

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