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Metal adhesives

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Aptek 2313-PMF Hybrid Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.

Production-oriented, snap-cure technology for surface mount applications-allows cure during solder reflow operation. High thixotropy/"tack" strength-holds components with minimal "Z" axis movement during cure. Stable viscosity for over 4 hours at RT-ideal for robotics. Low Tg (<-50°C) for excellent low temperature cycling and performance with minimal stress. Excellent substrate adhesion; superior to silicones: no primer required.

Information provided by Aptek Laboratories, Inc.

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Physical PropertiesOriginal ValueComments
Density 3.00 g/ccASTM D1475
 
Mechanical PropertiesOriginal ValueComments
Adhesive Bond Strength 325 psiAl-to-Al Lap Shear; Cured property; ASTM D1002
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.0030 ohm-cmCured property; ASTM D257
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity >= 1.50 W/m-KCOLORA
Glass Transition Temp, Tg <= -50.0 °CCured property; Perkin Elmer TM-2
Flash Point >= 200 °CASTM D92
 
Processing PropertiesOriginal ValueComments
Processing Temperature 85.0 °CCure 120 min.
 125 °CCure 30 min.
 260 °CCure 30 sec; through solder reflow process

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PAPTEK14 / 24176

Metal adhesives

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