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Metal adhesives

Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Cure Resin; Epoxy Encapsulant, Unreinforced

Material Notes: Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP965 Clear will reach full cure at room temperature within 24 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 110°C are typical for small castings (less than 50 grams).

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

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Physical PropertiesMetricEnglishComments
Specific Gravity 0.970 g/cc0.970 g/ccPart B; TM R050-16
 1.07 g/cc1.07 g/ccMixed; TM R050-16
 1.16 g/cc1.16 g/ccPart A; TM R050-16
Water Absorption 0.18 %
@Time 86400 sec
0.18 %
@Time 24.0 hour
TM R050-35
Viscosity 6000 cP6000 cPPart B, RVT, #6, 20 rpm; TM R050-12
 11000 cP11000 cPMixed; TM R050-12
 16000 cP16000 cPPart A, RVT, #6, 20 rpm; TM R050-12
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8080TM R050-17
Tensile Strength at Break 58.6 MPa8500 psiTM R050-36
Tensile Strength, Ultimate 58.6 MPa8500 psiTM R050-36
Tensile Strength, Yield 20.7 MPa3000 psiTM R050-36
Elongation at Break 0.00 - 2.0 %0.00 - 2.0 %TM R050-36
Tensile Modulus 2.76 GPa400 ksiTM R050-36
Compressive Yield Strength 68.9 MPa10000 psiTM R050-38
Compressive Strength 152 MPa22000 psiUltimate; TM R050-38
 152 MPa22000 psiBreak; TM R050-38
Compressive Modulus 2.07 GPa300 ksiTM R050-38
Adhesive Bond Strength 10.3 MPa1500 psiLap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 8.00e+14 ohm-cm8.00e+14 ohm-cm
Dielectric Constant 4.2
@Frequency 100 Hz,
Temperature 25.0 °C
4.2
@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 16.1 kV/mm410 kV/in
 
Thermal PropertiesMetricEnglishComments
CTE, linear  80.0 µm/m-°C
@Temperature <=61.0 °C
44.4 µin/in-°F
@Temperature <=142 °F
below Tg
 180 µm/m-°C
@Temperature >=61.0 °C
100 µin/in-°F
@Temperature >=142 °F
above Tg
Thermal Conductivity 0.178 W/m-K1.24 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C302 °F
Minimum Service Temperature, Air -40.0 °C-40.0 °F
Glass Transition Temp, Tg 61.0 °C142 °FTM R050-25
 
Optical PropertiesMetricEnglishComments
Transmission, Visible 90 %90 %clear; thickness not quantified
 
Processing PropertiesMetricEnglishComments
Pot Life 15 - 20 min15 - 20 minMass: 50g; TM R050-19
 
Descriptive Properties
ColorClear
Mix Ratio1:1Volume
 100:85Weight

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