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Master Bond adhesives

Dymax 9001v3.5 Low Modulus Clear Microencapsulant
Categories: Polymer; Adhesive; Thermoset

Material Notes:
High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 9001v3.5 Low Modulus Clear Microencapsulant
Lowest stress potting and encapsulation on ceramic, FR-4 or flexible PCBs Cure Type: UV/Visible Typical Use: Glob top, chip on board, "smart cards"

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Physical PropertiesMetricEnglishComments
Viscosity 20000 cP20000 cP
 
Optical PropertiesMetricEnglishComments
Transmission, Visible 90 %90 %clear; thickness not quantified
 
Processing PropertiesMetricEnglishComments
Cure Time 0.0333 - 0.167 min0.000556 - 0.00278 hour10-20 mil thick layers cured with Dymax 5000-EC at 2 inches. Thicker layers may require more cure time.
 
Descriptive Properties
ColorClear

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