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Elmet Technologies

Henkel Loctite® ABLESTIK 2332 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black

Product Benefits:

  • One component
  • Excellent adhesion
  • Non-conductive
  • Low temperature cure
  • High strength
Cure: Heat cure

Application: Non-conductive adhesive

Surfaces: Copper, Aluminum, Nickel, FRP and Rigid plastics

LOCTITE ABLESTIK 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C. This product combines toughness at low temperatures plus high peel and tensile shear strengths over a very broad temperature range.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.17 - 1.23 g/cc1.17 - 1.23 g/ccUncured
Viscosity 65000 - 85000 cP65000 - 85000 cPUncured
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D  30
@Temperature 120 °C
30
@Temperature 248 °F
Cured
 75
@Temperature 25.0 °C
75
@Temperature 77.0 °F
Cured
Tensile Modulus  0.0100 GPa
@Temperature 200 °C
1.45 ksi
@Temperature 392 °F
Cured, DMTA
 0.0200 GPa
@Temperature 150 °C
2.90 ksi
@Temperature 302 °F
Cured, DMTA
 0.508 GPa
@Temperature 100 °C
73.7 ksi
@Temperature 212 °F
Cured, DMTA
 1.043 GPa
@Temperature 50.0 °C
151.3 ksi
@Temperature 122 °F
Cured, DMTA
Shear Strength  1.20 MPa
@Temperature 50.0 °C
174 psi
@Temperature 122 °F
Lap, PBT, cured
 3.10 MPa
@Temperature 125 °C
450 psi
@Temperature 257 °F
Lap, PBT, cured
 4.90 MPa
@Temperature 150 °C
711 psi
@Temperature 302 °F
Lap, Aluminum, cured
 6.00 MPa
@Temperature 25.0 °C
870 psi
@Temperature 77.0 °F
Lap, PBT, cured
 12.5 MPa
@Temperature 125 °C
1810 psi
@Temperature 257 °F
Lap, Aluminum, cured
 15.3 MPa
@Temperature 90.0 °C
2220 psi
@Temperature 194 °F
Lap, Aluminum, cured
 20.4 MPa
@Temperature 25.0 °C
2960 psi
@Temperature 77.0 °F
Lap, Aluminum, cured
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 6.00e+14 ohm-cm6.00e+14 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 100 µm/m-°C55.6 µin/in-°FCured
Maximum Service Temperature, Air 150 °C302 °F
Minimum Service Temperature, Air -40.0 °C-40.0 °F
Glass Transition Temp, Tg 105 °C221 °FCured, TMA
Shrinkage 2.3 %2.3 %Cured
 
Processing PropertiesMetricEnglishComments
Cure Time  0.330 min
@Temperature 150 °C
0.00550 hour
@Temperature 302 °F
Alternative Curing Conditions
 0.500 min
@Temperature 120 °C
0.00833 hour
@Temperature 248 °F
Alternative Curing Conditions
 1.50 min
@Temperature 100 °C
0.0250 hour
@Temperature 212 °F
Alternative Curing Conditions
 60.0 min
@Temperature 120 °C
1.00 hour
@Temperature 248 °F
Typical
Shelf Life 6.00 Month
@Temperature 0.000 - 8.00 °C
6.00 Month
@Temperature 32.0 - 46.4 °F

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PLOCT5017 / 255228

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