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Flame Retardant adhesives

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Cookson Group Plaskon® SMT-B-2FPI Molding Compound for PBGA and CSP  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes: This material is an epoxy molding compound for high temperature, lead-free reflow in fine pitch applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 240°C IR reflow temperatures.

Features:

  • Lower moisture pickup
  • Excellent moldability
  • Low wire sweep
  • Fast cure

Information provided by Cookson Electronics
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.88 g/cc
Moisture Absorption at Equilibrium 0.51 %at 85°C/85% RH, 168 hours
Viscosity 6500 cP
@Temperature 175 °C		Shimadzu Viscosity, 1000 psi
Spiral Flow 140 cmat 175°C and 1000 psi
Ash 80 %
Storage Temperature <= 5.00 °CRecommended
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80Cull hot
Flexural Strength 14220 psi
 2844.7 psi
@Temperature 240 °C
Flexural Modulus 1.991e+6 psi
 213400 psi
@Temperature 240 °C
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+12 ohm-cm
@Temperature 150 °C
 >= 1.00e+15 ohm-cm
@Temperature 22.0 °C
Dielectric Constant 4.0
@Frequency 1000 Hz
Dielectric Strength >= 400 V/mil
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.0 µm/m-°C
@Temperature 20.0 °C		Alpha 1
 55.0 µm/m-°C
@Temperature 20.0 °C		Alpha 2
Thermal Conductivity 0.700 W/m-K
Glass Transition Temp, Tg 210 °C
Flammability, UL94 V-0
@Thickness 3.17 mm
 
Processing PropertiesOriginal ValueComments
Mold Temperature 170 - 185 °C
Back Pressure 750 - 1250 psi
Cure Time 70.0 - 120 secIn mold
 0.000 - 3.00 hour
@Temperature 175 °C		Post mold
Gel Time 0.333 minRam follower, at 175°C and 1000 psi
Shelf Life 0.100 Monthat 35°C, <40% loss of spiral flow
 0.250 Monthat 22°C, <40% loss of spiral flow
 24.0 Monthat 5°C, <40% loss of spiral flow
 
Descriptive Properties
Hydrolyzable Halides<1 ppm

**
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PPLASK015 / 56305

Flame Retardant adhesives




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