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Master Bond adhesives

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CP-Polymer-Technik Wellamid® 6600 MR 309 HWCP 30% Mineral Nylon 66, Heat Stabilized, Dry
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 66 (PA66); Nylon 66, 30% Mineral Filled

Material Notes: Information provided by CP-Polymer-Technik GmbH & Co. KG

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Physical PropertiesOriginal ValueComments
Density 1.36 g/ccISO 1183
Moisture Absorption at Equilibrium 1.8 - 2.3 %23°C/50%RH; DIN 53495
Linear Mold Shrinkage 0.0090 - 0.011 cm/cm
@Thickness 4.00 mm
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 80.0 MPa5 mm/min; ISO 527
Elongation at Break 5.0 %5 mm/min; ISO 527
Tensile Modulus 5.20 GPaISO 527
Flexural Modulus 4.50 GPaDIN 52457
Charpy Impact Unnotched 4.00 J/cm²
@Temperature 23.0 °C
ISO 179
Charpy Impact, Notched 0.500 J/cm²
@Temperature 23.0 °C
ISO 179
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+15 ohm-cmIEC 93
Surface Resistance 1.00e+12 ohmISO 3915
Dielectric Constant 4.0
@Frequency 1e+6 Hz
IEC 250
Dielectric Strength 35.0 kV/mmIEC 243-1
Dielectric Loss Index 0.015
@Frequency 1e+6 Hz
IEC 250
Comparative Tracking Index 450 VStufe; IEC 112
 
Thermal PropertiesOriginal ValueComments
CTE, linear 65.0 µm/m-°C
@Temperature 23.0 - 80.0 °C
DIN 53752
Melting Point 255 °CKofler
Deflection Temperature at 0.46 MPa (66 psi) 210 °CISO 179
Deflection Temperature at 1.8 MPa (264 psi) 120 °CISO 179
Vicat Softening Point 230 °C50 N; ISO 306
Flammability, UL94 HB
@Thickness 1.60 mm
Stufe; IEC 707
 HB
@Thickness 3.20 mm
Stufe; IEC 707
 
Processing PropertiesOriginal ValueComments
Melt Temperature 265 - 295 °C
Mold Temperature 80.0 - 100 °C
 
Descriptive Properties
Back PressureLow
Holding PressureHigh
Injection SpeedHigh
Screw SpeedMedium

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