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Master Bond adhesives

Copper Alloy, UNS C12510, H03 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 3/4 Hard

Fabrication Properties: Excellent Suitability - Soldering, Capacity for Being Cold Worked, Capacity for Being Hot Formed; Good Suitability - Brazing, Butt Weld; Fair - Gas Shielded Arc Welding

Common Fabrication Processes: Bending; Blanking; Coining; Coppersmithing; Forming; Stamping

Typical Uses: Building Fronts; Downspouts; Flashing; Gutters; Roofing

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 8.94 g/cc0.323 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 331 MPa48000 psi
Tensile Strength, Yield 310 MPa45000 psi0.2% Offset
Elongation at Break  2.0 %
@Thickness 0.0762 mm
2.0 %
@Thickness 0.00300 in
 6.0 %
@Thickness 0.508 mm
6.0 %
@Thickness 0.0200 in
Tensile Modulus 120 GPa17400 ksi
Modulus of Rigidity 44.1 GPa6400 ksi
Poissons Ratio 0.360.36Calculated
Machinability 20 %20 %
Forgeability 65 %65 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000187 ohm-cm0.00000187 ohm-cm92% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear  16.7 µm/m-°C
@Temperature 20.0 - 100 °C
9.30 µin/in-°F
@Temperature 68.0 - 212 °F
 17.3 µm/m-°C
@Temperature 20.0 - 200 °C
9.60 µin/in-°F
@Temperature 68.0 - 392 °F
 17.6 µm/m-°C
@Temperature 20.0 - 300 °C
9.80 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.385 J/g-°C0.0920 BTU/lb-°F
Thermal Conductivity 29.1 W/m-K202 BTU-in/hr-ft²-°F
Melting Point 1065 - 1083 °C1949 - 1981 °F
Solidus 1065 °C1949 °F
Liquidus 1083 °C1981 °F
 
Component Elements PropertiesMetricEnglishComments
Antimony, Sb <= 0.0030 %<= 0.0030 %
Bismuth, Bi <= 0.0050 %<= 0.0050 %
Copper, Cu >= 99.9 %>= 99.9 %
Iron, Fe <= 0.050 %<= 0.050 %
Lead, Pb <= 0.020 %<= 0.020 %
Nickel, Ni <= 0.050 %<= 0.050 %
Phosphorus, P <= 0.030 %<= 0.030 %
Tellurium, Te <= 0.025 %<= 0.025 %
Tin, Sn <= 0.050 %<= 0.050 %
Zinc, Zn <= 0.080 %<= 0.080 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC12510x3 / 291521

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