Description: This is one of a family of soft, adherent, silicone elastomeric gels designed for the encapsulation and protection of electronic components. It is a low viscosity, 2-component system that is readily mixed in a 1:1 ratio. It is used to provide protection from vibration, thermal or mechanical shock and protection from water and many environmental contaminants. It has excellent dielectric properties. Key Features - Low modulus minimizes stress on parts and components
- Fast room temperature cure
- Potted or encapsulated assemblies can be repaired with modest effort
- Primerless chemical adhesion at room temperature to many substrates
Information provided by CHT Group |