Parker Chomerics CHO-SHIELD® 2052 Conductive Coating

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Parker Chomerics CHO-SHIELD® 2052 Conductive Coating
Categories:	Polymer; Adhesive; Thermoset; Acrylic/Cyanoacrylate Adhesive
Material Notes:	CHO-SHIELD® 2052 silver-plated-copper filled commercial-grade coating proved high levels of EMI shielding effectiveness, abrasion resistance and excellent adhesion on a variety of materials used for electronic enclosures. Application: With their excellent leveling and uniformity, these coatings are compatible with all commercially available application technologies, including high volume/low pressure (HVLP) spray systems, and conventional propeller-agitated pressure pots. As low-settling compounds, they are ready for use after simple mixing in a paint shaker. They are supplied ready-to-spray, and don’t required additional thinning, although MEK can be used. . Information provided by Chomerics
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Physical Properties	Original Value	Comments

Specific Gravity	0.900 - 1.30 g/cc
Volatile Organic Compounds (VOC) Content	765 g/l
Thickness	2.00 mil	Recommended

Electrical Properties	Original Value	Comments
Surface Resistivity per Square	<= 0.050 ohm
	<= 0.040 ohm @Thickness 508 mm
Shielding Effectiveness	>= 75 dB	100 MHz - 2 GHz; Chomerics TP08

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	100 °C
Minimum Service Temperature, Air	-40.0 °C

Processing Properties	Original Value	Comments
Cure Time	20.0 min @Temperature 24.0 °C	Followed by 20 min 60°-75°C
	24.0 hour @Temperature 24.0 °C
Shelf Life	12.0 Month

Descriptive Properties
Binder	Acrylic
Consistency	Thin Fluid
Filler	Ag/Cu
Mix Ratio	1-part
Spraying Viscosity, #2 Zahn Cup	15 - 20 sec
Theoretical Coverage	194 ft²/gal

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