MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Master Bond adhesives

Henkel Loctite® ECCOBOND UF 3811 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black liquid

Cure: Heat cure

Product Benefits:

  • One component
  • Room temperature flow capability
  • Halogen free
  • Reworkable
  • Good thermal cycling reliability
  • Stable electrical performance under standard Surface Insulation Resistance (SIR)
Application: Underfill, Encapsulation

Typical Package Application: Chip scale packages and BGA

Typical Application: Flex applications

LOCTITE ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Viscosity 354 cP354 cPCP50-1, Speed 20 rpm
Outgassing - Total Mass Loss 0.31 %0.31 %WVR, NASA Outgassing
 0.45 %0.45 %TML, NASA Outgassing
Collected Volatile Condensable Material 0.040 %0.040 %NASA Outgassing
 
Mechanical PropertiesMetricEnglishComments
Flexural Modulus 2.445 GPa354.6 ksiStorage, DMA, 3-point bending
 
Electrical PropertiesMetricEnglishComments
Surface Resistance 1.00e+10 ohm1.00e+10 ohmInsulation, after 168 hours 60ºC/90% RH
 
Thermal PropertiesMetricEnglishComments
CTE, linear 61.0 µm/m-°C33.9 µin/in-°FCured, Below Tg
 190 µm/m-°C106 µin/in-°FCured, Above Tg
Thermal Conductivity 0.230 W/m-K1.60 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 124 °C255 °FCured, by TMA
 
Processing PropertiesMetricEnglishComments
Cure Time  7.00 min
@Temperature 150 °C
0.117 hour
@Temperature 302 °F
 10.0 min
@Temperature 130 °C
0.167 hour
@Temperature 266 °F
 30.0 min
@Temperature 110 °C
0.500 hour
@Temperature 230 °F
 60.0 min
@Temperature 100 °C
1.00 hour
@Temperature 212 °F
Pot Life 4320 min4320 min
Shelf Life 12.0 Month
@Temperature -20.0 °C
12.0 Month
@Temperature -4.00 °F

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

PLOCT5094 / 255305

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.