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Master Bond adhesives

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Epoxy Technology EPO-TEK® OG133-8 UV Cure Optical Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Material Description: A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133-5, and a non-flow version of EPO-TEK® OG133-7.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.13 g/cc
Particle Size <= 10 µm
Viscosity 1000 - 1500 cP
@Temperature 23.0 °C
100 rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 65
Tensile Modulus 1000 psiStorage
 
Thermal PropertiesOriginal ValueComments
CTE, linear 43.0 µm/m-°CBelow Tg
 222 µm/m-°CAbove Tg
Maximum Service Temperature, Air 150 °CContinuous
 250 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg <= 10.0 °CPost-Cure Dynamic Scan 20200°C; Ramp -40200°C @ 20°C/Min
Decomposition Temperature 353 °CDegradation Temperature
 
Optical PropertiesOriginal ValueComments
Refractive Index 1.505
@Wavelength 589 nm
Transmission, Visible >= 90 %
@Wavelength 640 nm
Spectral
 >= 95 %
@Wavelength 900 nm
Spectral
 
Processing PropertiesOriginal ValueComments
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorCloudy/Colorlessbefore cure
ConsistencySmooth thixotropic paste
Number of ComponentsSingle
Thixotropic Index3.1
Weight Loss2.37%200°C
 3.64%250°C
 5.72%300°C

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PPOXYT165 / 141204

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