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Dow SiLK™ I 620 Semiconductor Dielectric Resin  (discontinued **)
Categories: Polymer

Material Notes: SiLK™ I 620 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 620 is compatible with standard IC processing tools in todays fabrications. SiLK™ I 620 is fluorine-free, thus is compatible with Ti and Ta barrier materials.

Information provided by Dow

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Physical PropertiesOriginal ValueComments
Moisture Absorption 0.24 %80% R.H.
Thickness 0.620 microns3000 rpm
 0.560 - 0.790 microns2000-4000 rpm
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Ultimate 89.0 MPa
Tensile Strength, Yield 60.0 MPa
Tensile Modulus 2.45 GPa
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 2.6
@Frequency 100000 Hz
Dielectric Strength >= 400 kV/mm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 62.0 µm/m-°C
@Temperature 50.0 - 150 °C
Thermal Conductivity 0.190 W/m-K
 0.230 W/m-K
@Temperature 125 °C
Glass Transition Temp, Tg >= 490 °C
Decomposition Temperature 450 °C1% weight loss per hour
 
Optical PropertiesOriginal ValueComments
Refractive Index 1.63

**
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PDOW1068 / 30272

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