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Celanese Thermx® CGT33 BK010T PCT
Categories: Polymer; Thermoplastic; Polyester, TP; Polycyclohexylenedimethylene Terephthalate (PCT); Polycyclohexylenedimethylene Terephthalate (PCT), 30% Glass Reinforced

Material Notes: Thermx® CGT33 BK010T is a 30% glass fiber reinforced, toughened, black polycyclohexylenedimethylene terephthalate resin for injection molding.

Celenese acquired the Thermx product line from DuPont in 2010.

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Physical PropertiesOriginal ValueComments
Density 1.44 g/ccISO 1183
Filler Content 30 %
Linear Mold Shrinkage, Flow 0.0025 cm/cm
@Thickness 2.00 mm
ISO 294-4
Linear Mold Shrinkage, Transverse 0.0075 cm/cm
@Thickness 2.00 mm
ISO 294-4
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell M 65ASTM D 785
Tensile Strength at Break 116 MPaISO 527
Elongation at Break 2.8 %ISO 527
Tensile Modulus 8400 MPa
@Temperature 23.0 °C
ISO 527
Flexural Strength 175 MPaISO 178
Flexural Modulus 7400 MPaISO 178
Izod Impact, Notched (ISO) 10.0 kJ/m²
@Temperature 23.0 °C
ISO 180/1A
Charpy Impact Unnotched 5.50 J/cm²
@Temperature 23.0 °C
ISO 179/1eU
Charpy Impact, Notched 1.00 J/cm²
@Temperature 23.0 °C
ISO 179/1eA
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+15 ohm-cmASTM D 257
Surface Resistance 1.00e+16 ohmASTM D 257
Dielectric Constant 3.0
@Frequency 100000 Hz,
Temperature 23.0 °C
ASTM D 150
 3.0
@Frequency 1e+6 Hz,
Temperature 23.0 °C
ASTM D 150
 3.1
@Frequency 10000 Hz,
Temperature 23.0 °C
ASTM D 150
 3.2
@Frequency 1000 Hz,
Temperature 23.0 °C
ASTM D 150
Dielectric Strength 16.4 kV/mm
@Thickness 3.20 mm,
Temperature 23.0 °C
500 V/s, Short Time; ASTM D149
Dissipation Factor 0.0090
@Frequency 10000 Hz
ASTM D 150
 0.0090
@Frequency 100000 Hz
ASTM D 150
 0.011
@Frequency 1e+6 Hz
ASTM D 150
 0.011
@Frequency 1000 Hz
ASTM D 150
Comparative Tracking Index >= 600 VIEC 60112
 
Thermal PropertiesOriginal ValueComments
Melting Point 285 °C10°C/min; ISO 11357-1/-3
Deflection Temperature at 1.8 MPa (264 psi) 250 °CISO 75-1/-2
Flammability, UL94 HB
@Thickness 1.50 mm
IEC 60695-11-10
 HB
@Thickness 1.50 mm
UL94
 HB
@Thickness 3.00 mm
IEC 60695-11-10
 HB
@Thickness 3.00 mm
UL94
 
Processing PropertiesOriginal ValueComments
Melt Temperature 300 °COptimum
 295 - 310 °C
Mold Temperature 100 °COptimum
 80.0 - 120 °C
Drying Temperature 95.0 °C
Dry Time 4 - 6 hourDehumidified Dryer
Moisture Content <= 0.030 %
 
Descriptive Properties
ColorBlack
Drying RecommendedYes
FeaturesElectrical Properties, Good
 Toughness, Good
FillerGlass fiber reinforcement
FormsPellets
GenericPCT
Part Marking Code>PCT-IGF30<ISO 11469
Polymer FamilyPolyester
Polymer TypePCT
Processing MethodInjection Molding
Product CategoryElectrical Resins
 Glass Reinforced Resins
 Toughened Resins
Region AvailableAmericas
 Asia/Pacific
 Europe
Resin IdentificationPCT-IGF30ISO 1043
UsesConnectors
 E/E Applications

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PDTA7737 / 89696

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