| Description: Used throughout the world, CHO-THERM® thermal interface pads conform to uneven surfaces to lower the thermal resistance between hot components and heat sinks. These advanced materials utilized silicone resins filled with boron nitride or aluminum oxide particles to achieve a range of thermal performance levels. Easy to handle and apply, CHO-THERM® pads can provide electrical insulation while improving the thermal management of electronic systems, and lowering assembly costs. CHO-THERM® 1677 insulators, consisting of boron nitride particles in a fluorosilicone binder, were developed to withstand long-term exposure to environments which are damaging to conventional silicone materials: aircraft fuels and greases, cleaning solutions and solvents, or other petrochemicals and aromatic solvents. This material offers thermal performance equal to or better than that of alumina-filled elastomers, plus greater dielectric strength. Thermal and electrical interface performance approaches those of mica and grease in environments and applications not permitting the use of thermal grease. Glass cloth reinforce. Typical Applications: Power conversion equipment, Power supplies and UPS systems, Power semiconductors, Automotive electronics, Moto controllers, and TVs and consumer electronics Features/Benefits: Insulating pads reinforced with polymide (Kaptont) or fiberglass, Available in sheets, roll form or die-cut for use with standard semiconductor packages. Information provided by Chomerics |
