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Master Bond adhesives

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Polyplastics Freqtis® C0711A (PPS/LCP), Molding Compound
Categories: Polymer; Thermoplastic; Liquid Crystal Polymer (LCP); Polyphenylene Sulfide (PPS); Polyphenylene Sulfide (PPS); Molded

Material Notes: Both base resins (PPS and LCP) exhibit excellent heat resistance, dimensional stability and molding processability. Therefore Freqtis® is widely used for surface mounted electronic components. In addition, these compounds have characteristics appropriate for high-frequency device materials on account of their low dielectric losses in high frequency regions.

FREQTIS® molding compounds allow dielectric constant control through compounding with a high dielectric constant ceramic developed independently by Otsuka Chemical.p>Information provided by PolyPlastics.

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Physical PropertiesOriginal ValueComments
Density 2.02 g/ccISO 1183
 
Mechanical PropertiesOriginal ValueComments
Flexural Strength 180 MPaFlexural Strain: 2.2%; ISO 178
Flexural Modulus 14.0 GPaISO 178
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 7.0
@Frequency 1e+6 Hz
Volumetric method
Dissipation Factor 0.0020
@Frequency 3.00e+9 Hz
Perturbation method by cavity resonator
 
Thermal PropertiesOriginal ValueComments
CTE, linear 10.0 µm/m-°C
@Temperature 20.0 °C
ISO 11359-2
CTE, linear, Transverse to Flow 50.0 µm/m-°C
@Temperature 20.0 °C
ISO 11359-2
Flammability, UL94 V-0
@Thickness 3.00 mm

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PPOLPL045 / 57038

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