Henkel Loctite® ABLESTIK QMI516IE Adhesive

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Henkel Loctite® ABLESTIK QMI516IE Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver gray Product Benefits: Electrically conductive Hydrophobic Stable at high temperatures Void-free bondline Excellent adhesive strength Low temperature cure High adhesion to a variety of substrates Cure: Heat cure Application: Die attach Typical Package Application: Heat sensitive devices LOCTITE ABLESTIK QMI516IE electrically conductive adhesive is designed for die attach applications. LOCTITE ABLESTIK QMI516IE snap cure adhesive is designed for high throughput bonding applications. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	3.70 g/cc
Brookfield Viscosity	15900 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	1964 MPa	Cured, DMTA

Electrical Properties	Original Value	Comments
Volume Resistivity	0.0015 ohm-cm	Cured

Thermal Properties	Original Value	Comments
CTE, linear	92.0 µm/m-°C	Cured, Below Tg
	232 µm/m-°C	Cured, Above Tg
Maximum Service Temperature, Air	68.0 °C	DSC, on-set temperature
	73.0 °C	DSC, Peak Temp
Glass Transition Temp, Tg	43.0 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	1.00 min @Temperature 90.0 °C	Snap Cure
	1.50 min @Temperature 60.0 °C	Oven Cure
Pot Life	6.00 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
	<10	Cured, Fluoride (F-)
Shear Strength	11 kg-f	Die, Oven Cure 1 minute @ 150ºC, 300 mil²
Thixotropic Index	5.6	0.5/5 rpm

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PLOCT5059 / 255270

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