Bakelite® MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength

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Bakelite® MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
Categories:	Polymer; Thermoset; Melamine; Melamine-Phenolic Copolymer; Phenolic
Material Notes:	Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94 V-0 / 1,5 mm (MP 4165-8899-S5), UL 94 V-0 / 1,6 mm (not listed). Applications: Commutators for electrical motors (e.g. fuel pumps, actuators, HVAC motors, fan motors, window lift motors, ABS, wiper, motors, garden appliances, household appliances, power tools, universal motors).
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Physical Properties	Original Value	Comments

Density	1.81 g/cc	ISO 1183
Apparent Bulk Density	0.650 g/cc	ISO 60
Linear Mold Shrinkage	0.0015 cm/cm	Injection Molding. Post Shrinkage = 0.25%.; ISO 2577
	0.0025 cm/cm	Compression Molding. Post Shrinkage = 0.25%.; ISO 2577

Mechanical Properties	Original Value	Comments
Ball Indentation Hardness	290 MPa	H961/30; ISO 2039/P1
Tensile Strength	60.0 MPa	ISO 527 - 1/2
Tensile Modulus	13000 MPa	ISO 527 - 1/2
Flexural Strength	115 MPa	ISO 178
Flexural Modulus	14000 MPa	ISO 178
Compressive Strength	160 MPa	ISO 604
Charpy Impact Unnotched	7.50 kJ/m²	ISO 179-1 eU

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+12 ohm-cm
Surface Resistance	1.00e+11 ohm
Dielectric Constant	7.5 @Frequency 100 Hz
Dielectric Strength	28.5 kV/mm @Thickness 1.00 mm	IEC 60243-P1
Dissipation Factor	0.10 @Frequency 100 Hz
Comparative Tracking Index	300 V

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	150 °C	<20000 hours; IEC 60216-P1
	190 °C	< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa	135 °C	ISO 75-2

Processing Properties	Original Value	Comments
Feed Temperature	60.0 - 75.0 °C	Injection molding
Nozzle Temperature	80.0 - 100 °C	Injection molding
Melt Temperature	80.0 - 100 °C	Injection molding
Mold Temperature	160 - 170 °C	Injection molding
	160 - 170 °C	Compression molding
Injection Pressure	>= 15.0 MPa	Compression and injection cavity mold pressure
Back Pressure	0.500 - 2.00 MPa	Injection molding
Cure Time	10.0 - 20.0 sec	Per 1 mm of wall thickness, injection molding
	20.0 - 40.0 sec	Per 1 mm of wall thickness, compression molding

Descriptive Properties
Holding Pressure	Approximately 40-60% of injection pressure
Water absorption (mg)	20	24h / 23°C

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