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Master Bond adhesives

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HP Alloys Alloy B-2, Solution Treated, 30% Cold Worked
Categories: Metal; Nonferrous Metal; Nickel Alloy; Superalloy

Material Notes: Solution Treated, 30% Cold Worked applies to tensile and/or hardness; other properties are typical of this alloy.

Data provided by High Performance Alloys, Inc. and Haynes International.

Key Words: ASME SB-333, ASME SB-335, ASME SB-619, ASME SB-622, ASME SB-626 UNS N10665
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 9.22 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Brinell 390Estimated from Rockwell C
Hardness, Rockwell A 72Estimated from Rockwell C
Hardness, Rockwell C 43
Hardness, Vickers 415Estimated from Rockwell C
Modulus of Elasticity 189 GPa
@Thickness 12.7 mm,
Temperature 538 °C
(Heat treated at 1066°C (1950°F), rapid quenched, plate)
 196 GPa
@Thickness 12.7 mm,
Temperature 427 °C
(Heat treated at 1066°C (1950°F), rapid quenched, plate)
 202 GPa
@Thickness 12.7 mm,
Temperature 316 °C
(Heat treated at 1066°C (1950°F), rapid quenched, plate)
 217 GPa
@Thickness 12.7 mm,
Temperature 21.1 °C
(Heat treated at 1066°C (1950°F), rapid quenched, plate)
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.000137 ohm-cm
@Temperature 0.000 °C
 0.000138 ohm-cm
@Temperature 100 °C
 0.000138 ohm-cm
@Temperature 200 °C
 0.000139 ohm-cm
@Temperature 300 °C
 0.000139 ohm-cm
@Temperature 400 °C
 0.000141 ohm-cm
@Temperature 500 °C
 0.000146 ohm-cm
@Temperature 600 °C
 
Thermal PropertiesOriginal ValueComments
CTE, linear 10.3 µm/m-°C
@Temperature 20.0 - 93.0 °C
 10.8 µm/m-°C
@Temperature 20.0 - 204 °C
 11.2 µm/m-°C
@Temperature 20.0 - 316 °C
 11.5 µm/m-°C
@Temperature 20.0 - 427 °C
 11.7 µm/m-°C
@Temperature 20.0 - 538 °C
Specific Heat Capacity 0.373 J/g-°C
@Temperature 0.000 °C
 0.389 J/g-°C
@Temperature 100 °C
 0.406 J/g-°C
@Temperature 200 °C
 0.423 J/g-°C
@Temperature 300 °C
 0.431 J/g-°C
@Temperature 400 °C
 0.444 J/g-°C
@Temperature 500 °C
 0.456 J/g-°C
@Temperature 600 °C
Thermal Conductivity 11.1 W/m-K
@Temperature 0.000 °C
 12.2 W/m-K
@Temperature 100 °C
 13.4 W/m-K
@Temperature 200 °C
 14.6 W/m-K
@Temperature 300 °C
 16.0 W/m-K
@Temperature 400 °C
 17.3 W/m-K
@Temperature 500 °C
 18.7 W/m-K
@Temperature 600 °C
 
Component Elements PropertiesOriginal ValueComments
Carbon, C 0.010 %
Chromium, Cr 1.0 %
Cobalt, Co <= 1.0 %
Iron, Fe <= 2.0 %
Manganese, Mn <= 1.0 %
Molybdenum, Mo 28 %
Nickel, Ni 69 %
Silicon, Si <= 0.10 %

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