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Metal adhesives

Tra-Con Tra-Bond FS291 Thixotropic Room Temperature Cure Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy

Material Notes: TRA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical. This medium exotherming system exhibits excellent flow and wetting characteristics for precisely located dispensing from static mixing cartridges. Fully cured TRA-BOND FS291 may be employed on a wide variety of substrates including glass, most metals, and variety of plastics and provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.

Information provided by Tra-Con Inc.

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Physical PropertiesMetricEnglishComments
Solids Content 100 %100 %Reactive Solids Content
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8080
Adhesive Bond Strength 22.8 MPa3300 psiLap shear, alum to alum
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.70e+13 ohm-cm2.70e+13 ohm-cm
 
Processing PropertiesMetricEnglishComments
Cure Time  60.0 min
@Temperature 65.0 °C
1.00 hour
@Temperature 149 °F
 1440 min
@Temperature 25.0 °C
24.0 hour
@Temperature 77.0 °F
 
Descriptive Properties
Mix Ratio, parts by weight100/81Resin/Hardener

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PTRAC277 / 71205

Metal adhesives

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