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Master Bond adhesives

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Bakelite® Keripol® RW 1411 Polyester Molding Compound, Low Shrinkage, Resistant to High Temperatures
Categories: Polymer; Thermoset; Filled/Reinforced Thermoset; Polyester, TS; Thermoset Polyester Glass Filled BMC

Material Notes: Polyester molding compound, inorganically filled glass fiber reinforced, styrene free, tracking resistance 600 V, good heat resistance, high viscosity flow characteristics.

Applications: H4 and H7 lamp sockets.

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Physical PropertiesOriginal ValueComments
Density 2.15 g/ccISO 1183
Apparent Bulk Density 1.00 g/ccISO 60
Linear Mold Shrinkage 0.0015 cm/cmCompression Molding. Post Shrinkage = -0.03%.; ISO 2577
 
Mechanical PropertiesOriginal ValueComments
Flexural Strength 85.0 MPaISO 178
Flexural Modulus 17000 MPaISO 178
Charpy Impact Unnotched 5.00 kJ/m²ISO 179-1 eU
Charpy Impact, Notched 2.00 kJ/m²ISO 179-1eA
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cm
Surface Resistance 1.00e+12 ohm
Dielectric Constant 6.0
@Frequency 100 Hz
Dielectric Strength 30.0 kV/mm
@Thickness 1.00 mm
IEC 60243-P1
Dissipation Factor 0.0080
@Frequency 100 Hz
Comparative Tracking Index 600 V
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 8.0 MPa 160 °CISO 75-2
 
Descriptive Properties
Water absorption (mg)1524h / 23°C

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PBAKE059 / 27093

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