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Master Bond adhesives

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Silver-bearing tough pitch Copper, UNS C11500, H00 Temper flat products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Good to excellent corrosion resistance. Excellent hot and cold workability; good forgeability. Fabricated by coining, coppersmithing, drawing and upsetting, hot forging and pressing, spinning, swaging, stamping.

Applications: gaskets, radiators, busbars, windings, switches, chemical process equipment, clad metals, printed circuit foil.

Test specimens: flat products - 1mm and 6mm thicknesses.

Key Words: STP
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 8.89 - 8.94 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell B 10
Hardness, Rockwell F 60
Hardness, Rockwell 30T 25
@Thickness 1.00 mm
Tensile Strength, Ultimate 250 MPa
Tensile Strength, Yield 195 MPa
Elongation at Break 30 %
@Thickness 1.00 mm
In 50 mm
 40 %
@Thickness 6.00 mm
In 50 mm
Modulus of Elasticity 115 GPa
Poissons Ratio 0.307
Machinability 20 %UNS C36000 (free-cutting brass) = 100%
Forgeability 65 %UNS C37700 (forging brass) = 100%
Shear Modulus 44.0 GPa
Shear Strength 170 MPa
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000172 ohm-cm
@Temperature 20.0 °C
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.7 µm/m-°C
@Temperature 20.0 - 300 °C
Specific Heat Capacity 0.385 J/g-°C
Thermal Conductivity 388 W/m-K
@Temperature 20.0 °C
Melting Point <= 1080 °C
Liquidus 1080 °C
Annealing Point 900 - 1400 °F
 
Processing PropertiesOriginal ValueComments
Annealing Temperature 475 - 750 °C
Hot-Working Temperature 750 - 875 °C
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu 99 - 99.9 %
Oxygen, O <= 0.040 %
Silver, Ag <= 0.054 %

References for this datasheet.

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