Cosmic Plastics E4920D Mineral Filled Epoxy Molding Compound

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Cosmic Plastics E4920D Mineral Filled Epoxy Molding Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled
Material Notes:	Description: Cosmic E4920D is a mineral filled epoxy molding compound which is available either in a granular form, or preformed in a variety of sizes and weights. Features: It has excellent moisture resistance, thermal cycling stability and outstanding moldability. Parts molded from this material do not support fungus growth. It is available in a wide flow range to suit custom molding requirements. E4920D can be supplied in black, gold, green or red. It has a shelf life of eight months when stored at 50C. Applications: It is designed for encapsulation of passive devices such as capacitors, inductors, diodes and rectifiers. Information provided by Cosmic Plastics Inc
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Specific Gravity	1.85 g/cc
Bulk Factor	2.0 - 5.0
Water Absorption	0.25 % @Temperature 50.0 °C, Time 173000 sec
Linear Mold Shrinkage	0.0020 - 0.0040 in/in

Mechanical Properties	Original Value	Comments
Hardness, Barcol	65
Tensile Strength at Break	12000 psi
Flexural Strength	15000 psi
Flexural Modulus	2.00e+6 psi
Compressive Strength	35000 psi
Izod Impact, Notched	0.500 ft-lb/in

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+15 ohm-cm
Surface Resistance	1.00e+15 ohm
Dielectric Constant	3.9 @Frequency 1000 Hz	Wet
	4.3 @Frequency 1e+6 Hz	Wet
Dielectric Strength	350 V/mil	Wet, step by step
Dielectric Breakdown	56 V	Wet, step by step
Dissipation Factor	0.011 @Frequency 1e+6 Hz	Wet
	0.012 @Frequency 1000 Hz	Wet
Arc Resistance	180 sec

Thermal Properties	Original Value	Comments
CTE, linear	25.0 µm/m-°C	Alpha 1
	70.0 µm/m-°C	Alpha 2
Thermal Conductivity	0.00160 cal cm/sec-cm²-°C
Heat Distortion Temperature	260 °C
Glass Transition Temp, Tg	175 °C
Flammability, UL94	V-0 @Thickness 1.59 mm

Processing Properties	Original Value	Comments
Mold Temperature	150 - 180 °C

Descriptive Properties
MIL-M-14	MEC	ASTM D5948-96
	MEE	ASTM D5948-96
	MEG	ASTM D5948-96
	MEH	ASTM D5948-96
Molding Pressure	500-8000 psi

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Lord Adhesives Thermoset™ ME-542 Underfill Encapsulant
Epoxy Technology EPO-TEK® TD1001 Thermally Conductive Epoxy
DIAB Divinycell® H 200 Sandwich Core Material
Cosmic Plastics FARBOSET® 2460 All Colors Mineral Filled Epoxy Molding Compound
Cosmic Plastics E4940 Mineral & Glass Filled Epoxy Molding Compound, Encapsulating Grade

PCOSM019 / 190801

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message