Parker Chomerics Tecknit Teckfip™ FIP-C (SP) Formed in Place Conductive Elastomer

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Parker Chomerics Tecknit Teckfip™ FIP-C (SP) Formed in Place Conductive Elastomer
Categories:	Polymer
Material Notes:	Description: This is the small particle version of the FIP-C compound. It was specifically designed for mobile cell phone applications, which require a high degree of EMI shielding. While the compound has been optimized for its overall shielding effectiveness, high cycling applications are not recommended for this material. This compound is ideally designed for projects that will not get opened and closed frequently, such as mobile phones. Information provided by Chomerics
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Physical Properties	Original Value	Comments

Specific Gravity	1.794 - 2.427 g/cc

Mechanical Properties	Original Value	Comments
Hardness, Shore A	50 - 60
Tensile Strength	>= 157 psi
Elongation at Break	31 %
Peel Strength	>= 9.00 kN/m
Compression Set	10 - 25 %
	57 % @Temperature 70.0 °C, Time 79200 sec

Electrical Properties	Original Value	Comments
Volume Resistivity	0.018 ohm-cm
Surface Resistance	<= 0.010 ohm

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	125 °C
Minimum Service Temperature, Air	-55.0 °C

Processing Properties	Original Value	Comments
Cure Time	<= 24.0 hour
Tack-Free Time	>= 0.100 hour
Shelf Life	1.00 Month	Syringe
	6.00 Month	Cartridge

Descriptive Properties
Color	Beige
Filler	Silver/Copper

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PCHOME362 / 131072

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