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Ensinger SPI

Ensinger TECACOMP PPA LDS black 1014979 Polyphthalamide
Categories: Polymer; Thermoplastic; Polyphthalamide (PPA)

Material Notes:
  • developed for the LPKF-LDS® process
  • high adhesive strength
  • good heat deflection temperature
Target Industries:
  • automotive industry
  • electrical engineering
  • LED lighting technology
  • mechanical engineering
former material REZ-RS-4108

Information provided by Ensinger Inc.

Vendors: Ensinger High Performance Plastics withstand severe environments, resist harsh chemicals, and perform well in extreme temperatures. They offer weight savings that have potential to drive lower cost systems.

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Physical PropertiesMetricEnglishComments
Density 1.96 g/cc0.0708 lb/in³
Water Absorption 0.35 %0.35 %DIN EN ISO 1110
Linear Mold Shrinkage, Flow 0.0167 cm/cm0.0167 in/inDIN EN ISO 294-4
Linear Mold Shrinkage, Transverse 0.0145 cm/cm0.0145 in/inDIN EN ISO 294-4
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 76.0 MPa11000 psiDIN EN ISO 527-1
Elongation at Break 1.2 %1.2 %DIN EN ISO 527-1
Modulus of Elasticity 9.20 GPa1330 ksiDIN EN ISO 527-1
Charpy Impact Unnotched 2.50 J/cm²11.9 ft-lb/in²DIN EN ISO 179-1eU
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+17 ohm-cm1.00e+17 ohm-cmDIN EN 61340-2-3
Surface Resistance 1.00e+15 ohm1.00e+15 ohmDIN EN 61340-2-3
Dielectric Constant 4.1
@Frequency 1e+9 Hz
4.1
@Frequency 1e+9 Hz
Dissipation Factor 0.013
@Frequency 1e+9 Hz
0.013
@Frequency 1e+9 Hz
Comparative Tracking Index 550 V550 VDIN EN 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow  43.0 µm/m-°C
@Temperature 50.0 - 100 °C
23.9 µin/in-°F
@Temperature 122 - 212 °F
DIN EN ISO 11359-1;2
 62.0 µm/m-°C
@Temperature 100 - 150 °C
34.4 µin/in-°F
@Temperature 212 - 302 °F
DIN EN ISO 11359-1;2
 97.0 µm/m-°C
@Temperature 150 - 200 °C
53.9 µin/in-°F
@Temperature 302 - 392 °F
DIN EN ISO 11359-1;2
CTE, linear, Transverse to Flow  47.0 µm/m-°C
@Temperature 50.0 - 100 °C
26.1 µin/in-°F
@Temperature 122 - 212 °F
DIN EN ISO 11359-1;2
 71.0 µm/m-°C
@Temperature 100 - 150 °C
39.4 µin/in-°F
@Temperature 212 - 302 °F
DIN EN ISO 11359-1;2
 112 µm/m-°C
@Temperature 150 - 200 °C
62.2 µin/in-°F
@Temperature 302 - 392 °F
DIN EN ISO 11359-1;2
Thermal Conductivity 0.900 W/m-K6.25 BTU-in/hr-ft²-°Fin-plane; ISO 22007-4:2008
 1.20 W/m-K8.33 BTU-in/hr-ft²-°Fthrough-plane; ISO 22007-4:2008
Melting Point 315 °C599 °F
Maximum Service Temperature, Air 150 °C302 °Flong term
 250 °C482 °Fshort term
Deflection Temperature at 1.8 MPa (264 psi) 237 °C459 °FISO-R 75 Method A
Glass Transition Temp, Tg 120 °C248 °F
Flammability, UL94 HB
@Thickness 3.20 mm
HB
@Thickness 0.126 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 300 - 340 °C572 - 644 °F
Mold Temperature 90.0 - 160 °C194 - 320 °F
Drying Temperature 120 °C248 °F
Dry Time 4.00 - 8.00 hour4.00 - 8.00 hour
Moisture Content <= 0.050 %<= 0.050 %Permissible residual moisture content
 
Descriptive Properties
Colorblack

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PENSIO9121 / 319049

Chemically Resistant adhesives

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