MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Specialty Compounds RTP Company

(Viewing data as-entered. Click here to return)
Park Aerospace Nelco® N4000-29 Multifunctional Epoxy
Categories: Polymer; Thermoset; Epoxy
Material Notes: The Nelco N4000-29 is an advanced, lead-free, low-CTE, high Tg (185º C by DSC) multifunctional epoxy dielectric substrate. This material has been designed for use not only in standard multilayer PWB designs, but for today’s toughest, high-performance, lead-free applications.

Key Features and Benefits:

  • Low Z-axis expansion
  • High Tg, excellent thermal stability and moisture resistance
  • CAF Resistant
  • Proprietary resin chemistry
  • Superior electrical properties
  • Optimized FR-4 processing

Applications/Qualifications:

  • Advanced Lead-Free Assembly Substrate
  • Large Format Backplanes
  • Tight Tolerance Via to Via Applications
  • High I / O Count BGA Substrates
  • Extreme Layer Count Multilayers
  • Lead-Free DCA Applications
  • High Temperature Underhood Automotive
  • Telecommunications Infrastructure
  • Sophisticated Data Storage Applications
  • RoHS Compliant
  • Meets IPC-4101/28, /98, /99 and /126 Specifications

Information provided by Park Electrochemical Corp.
Key Words: EP
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.99 g/cc50% Resin Content; Internal Method
Water Absorption 0.15 %IPC-TM-650.2.6.2.1
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 2900 ksiY; ASTM D3039
 3600 ksiX; ASTM D3039
Poissons Ratio 0.16Y; ASTM D3039
 0.18X; ASTM D3039
Peel Strength 8.90 pliat elevated temperature; IPC-TM-650.2.4.8.2a
 9.70 pliafter exposure to process solutions; IPC-TM-650.2.4.8
 10.7 pliafter solder float; IPC-TM-650.2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+14 ohm-cmE - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+12 ohmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohmE - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 4.0
@Frequency 1e+10 Hz		Stripline; IPC-TM-650.2.5.5.5
 4.2
@Frequency 1e+10 Hz		Split Post Cavity
 4.3
@Frequency 1e+9 Hz		RF Impedance; IPC-TM-650.2.5.5.9
 4.5
@Frequency 1e+6 Hz		TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength 1100 V/milIPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 VIPC-TM-650.2.5.6
Dissipation Factor 0.015
@Frequency 2.50e+9 Hz		Split Post Cavity
 0.016
@Frequency 1e+6 Hz		TFC/LCR Meter; IPC-TM-650.2.5.5.3
 0.017
@Frequency 1e+10 Hz		Split Post Cavity
Arc Resistance 129 secIPC-TM-650.2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 6.67 - 8.33 µin/in-°F
@Temperature -40.0 - 125 °C		X/Y; IPC-TM-650.2.4.41
 30.6 µin/in-°F
@Temperature 50.0 - 185 °C		Z-Axis Alpha 1; IPC-TM-650.2.4.41
 147 µin/in-°F
@Temperature 185 - 260 °C		Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity 0.220 BTU/lb-°FASTM E1461-92
Thermal Conductivity 3.19 BTU-in/hr-ft²-°FASTM E1461-92
Glass Transition Temp, Tg >= 175 °CTMA; IPC-TM-650.2.4.24c
 >= 185 °CDSC; IPC-TM-650.2.4.25c
Decomposition Temperature 350 °C5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
 
Descriptive Properties
Methylene Chloride Resistance (% Weight Change)0.01IPC-TM-650.2.3.4.3
Pressure CookerPass60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)>60IPC-TM-650.2.4.24.1
T288 (minutes)15IPC-TM-650.2.4.24.1
Z Axis Expansion (%)350ºC to 260ºC; IPC-TM-650.2.4.41

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Park Aerospace Nelco® N4000-13 SI® High-Speed Multifunctional Epoxy Laminate and Prepreg
Epoxy Technology EPO-TEK® H67-MP Thermally Conductive Epoxy
Park Aerospace Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg
Park Aerospace Nelco® N4000-12 SI® High Speed/Low Loss, CAF Resistant Laminate and Prepreg
Park Aerospace Nelco® N4000-13 High-Speed Multifunctional Epoxy Laminate and Prepreg

PPARK117 / 89389




Searches:   Advanced  •   Composition  •   Property  •   Material Type  •   Manufacturer  •   Trade Name  •   UNS Number
Other Links:   Advertising  •   Submit Data  •   Database Licensing  •   Web Design & Hosting  •   Trade Publications
Supplier List  •   Unit Converter  •   Reference  •   Links  •   Help  •   Contact Us  •   Site Map  •   FAQ  •   Home
 
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at info@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.