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Ensinger PEI

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Park Aerospace Nelco® N4000-29 Multifunctional Epoxy
Categories: Polymer; Thermoset; Epoxy
Material Notes: The Nelco N4000-29 is an advanced, lead-free, low-CTE, high Tg (185º C by DSC) multifunctional epoxy dielectric substrate. This material has been designed for use not only in standard multilayer PWB designs, but for today’s toughest, high-performance, lead-free applications.

Key Features and Benefits:

  • Low Z-axis expansion
  • High Tg, excellent thermal stability and moisture resistance
  • CAF Resistant
  • Proprietary resin chemistry
  • Superior electrical properties
  • Optimized FR-4 processing

Applications/Qualifications:

  • Advanced Lead-Free Assembly Substrate
  • Large Format Backplanes
  • Tight Tolerance Via to Via Applications
  • High I / O Count BGA Substrates
  • Extreme Layer Count Multilayers
  • Lead-Free DCA Applications
  • High Temperature Underhood Automotive
  • Telecommunications Infrastructure
  • Sophisticated Data Storage Applications
  • RoHS Compliant
  • Meets IPC-4101/28, /98, /99 and /126 Specifications

Information provided by Park Electrochemical Corp.
Key Words: EP
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.99 g/cc50% Resin Content; Internal Method
Water Absorption 0.15 %IPC-TM-650.2.6.2.1
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 2900 ksiY; ASTM D3039
 3600 ksiX; ASTM D3039
Poissons Ratio 0.16Y; ASTM D3039
 0.18X; ASTM D3039
Peel Strength 8.90 pliat elevated temperature; IPC-TM-650.2.4.8.2a
 9.70 pliafter exposure to process solutions; IPC-TM-650.2.4.8
 10.7 pliafter solder float; IPC-TM-650.2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+14 ohm-cmE - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+12 ohmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohmE - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 4.0
@Frequency 1e+10 Hz		Stripline; IPC-TM-650.2.5.5.5
 4.2
@Frequency 1e+10 Hz		Split Post Cavity
 4.3
@Frequency 1e+9 Hz		RF Impedance; IPC-TM-650.2.5.5.9
 4.5
@Frequency 1e+6 Hz		TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength 1100 V/milIPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 VIPC-TM-650.2.5.6
Dissipation Factor 0.015
@Frequency 2.50e+9 Hz		Split Post Cavity
 0.016
@Frequency 1e+6 Hz		TFC/LCR Meter; IPC-TM-650.2.5.5.3
 0.017
@Frequency 1e+10 Hz		Split Post Cavity
Arc Resistance 129 secIPC-TM-650.2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 6.67 - 8.33 µin/in-°F
@Temperature -40.0 - 125 °C		X/Y; IPC-TM-650.2.4.41
 30.6 µin/in-°F
@Temperature 50.0 - 185 °C		Z-Axis Alpha 1; IPC-TM-650.2.4.41
 147 µin/in-°F
@Temperature 185 - 260 °C		Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity 0.220 BTU/lb-°FASTM E1461-92
Thermal Conductivity 3.19 BTU-in/hr-ft²-°FASTM E1461-92
Glass Transition Temp, Tg >= 175 °CTMA; IPC-TM-650.2.4.24c
 >= 185 °CDSC; IPC-TM-650.2.4.25c
Decomposition Temperature 350 °C5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
 
Descriptive Properties
Methylene Chloride Resistance (% Weight Change)0.01IPC-TM-650.2.3.4.3
Pressure CookerPass60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)>60IPC-TM-650.2.4.24.1
T288 (minutes)15IPC-TM-650.2.4.24.1
Z Axis Expansion (%)350ºC to 260ºC; IPC-TM-650.2.4.41

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PPARK117 / 89389

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