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Master Bond adhesives

305 Stainless Steel, High tensile bar, wire
Categories: Metal; Ferrous Metal; Stainless Steel; T 300 Series Stainless Steel

Material Notes: Same corrosion resistance and Type 302, but much lower rate of work hardening. Excellent cold formability, good free spinning and cold heading properties, recommended for severe cold drawing. Applications include electronic parts and other drawn applications.

Key Words: UNS S30500,, DIN 1.4303, UNI X8 CrNi 19 10, JIS SUS 305, SUS 305 J1, ISO 4954 X5CrNi1812E, ISO 683/13 13, 18-8
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Physical PropertiesMetricEnglishComments
Density 8.00 g/cc0.289 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 1690 MPa245000 psi
Elongation at Break 25 %
@Diameter <=3.96 mm
25 %
@Diameter <=0.156 in
Reduction of Area 40 %
@Diameter <=3.96 mm
40 %
@Diameter <=0.156 in
Modulus of Elasticity 193 GPa28000 ksi
Shear Modulus 86.0 GPa12500 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000720 ohm-cm
@Temperature 20.0 °C
0.0000720 ohm-cm
@Temperature 68.0 °F
Magnetic Permeability 1.0081.008at RT
 
Thermal PropertiesMetricEnglishComments
CTE, linear  17.3 µm/m-°C
@Temperature 0.000 - 100 °C
9.61 µin/in-°F
@Temperature 32.0 - 212 °F
 17.8 µm/m-°C
@Temperature 0.000 - 315 °C
9.89 µin/in-°F
@Temperature 32.0 - 599 °F
 18.4 µm/m-°C
@Temperature 0.000 - 540 °C
10.2 µin/in-°F
@Temperature 32.0 - 1000 °F
 18.7 µm/m-°C
@Temperature 0.000 - 650 °C
10.4 µin/in-°F
@Temperature 32.0 - 1200 °F
Specific Heat Capacity 0.500 J/g-°C
@Temperature 0.000 - 100 °C
0.120 BTU/lb-°F
@Temperature 32.0 - 212 °F
Thermal Conductivity  16.3 W/m-K
@Temperature 100 °C
113 BTU-in/hr-ft²-°F
@Temperature 212 °F
 21.5 W/m-K
@Temperature 500 °C
149 BTU-in/hr-ft²-°F
@Temperature 932 °F
Melting Point 1400 - 1455 °C2550 - 2651 °F
Solidus 1400 °C2550 °F
Liquidus 1455 °C2651 °F
 
Component Elements PropertiesMetricEnglishComments
Carbon, C <= 0.12 %<= 0.12 %
Chromium, Cr 18 %18 %
Iron, Fe 67 %67 %
Manganese, Mn <= 2.0 %<= 2.0 %
Nickel, Ni 12 %12 %
Phosphorus, P <= 0.045 %<= 0.045 %
Silicon, Si <= 1.0 %<= 1.0 %
Sulfur, S <= 0.030 %<= 0.030 %

References for this datasheet.

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