Henkel Loctite® ECCOBOND FP4451 Epoxy

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Henkel Loctite® ECCOBOND FP4451 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Cure: Heat cure Product Benefits: High purity Minimal slumping Green product Application: Encapsulant - dam Typical Package Application: BGA and IC memory cards LOCTITE ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type. Information provided by Loctite®
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Physical Properties	Metric	English	Comments

Specific Gravity	1.76 g/cc	1.76 g/cc
Filler Content	72 %	72 %
Brookfield Viscosity	860000 cP	860000 cP	Spindle 7, speed 4 rpm
	1.30e+6 cP	1.30e+6 cP	Spindle 7, speed 2 rpm

Thermal Properties	Metric	English	Comments
CTE, linear	22.0 µm/m-°C @Temperature 40.0 - 120 °C	12.2 µin/in-°F @Temperature 104 - 248 °F	Cured, Below Tg
Maximum Service Temperature, Air	150 °C	302 °F
Minimum Service Temperature, Air	-65.0 °C	-85.0 °F
Glass Transition Temp, Tg	155 °C	311 °F	Cured, by TMA

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F	plus 90 minutes @ 165°C
	60.0 min @Temperature 165 °C	1.00 hour @Temperature 329 °F	Alternate Cure Schedule
Pot Life	2880 min	2880 min	time to double viscosity
Gel Time	8.00 min @Temperature 121 °C	8.00 min @Temperature 250 °F
Shelf Life	9.00 Month @Temperature -40.0 °C	9.00 Month @Temperature -40.0 °F	from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	1		Cured, Potassium (K+)
	10		Cured, Chloride (Cl-)
	4		Cured, Sodium (Na+)

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PLOCT5090 / 255301

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