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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and flexible in order to resist PCB drop testing.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.06 g/ccPart B
 4.03 g/ccPart A
Particle Size <= 20 µm
Viscosity 13000 - 18000 cP
@Temperature 23.0 °C
20 rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 77
Tensile Modulus 201000 psiStorage
Shear Strength 1392 psiLap
 >= 1700 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.00020 ohm-cm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 30.0 µm/m-°CBelow Tg
 212 µm/m-°CAbove Tg
Thermal Conductivity 2.30 W/m-K
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 20.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 363 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 hour
@Temperature 150 °C
 2.00 hour
@Temperature 125 °C
Pot Life 600 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorAmberPart B
 SilverPart A
ConsistencySmooth thixotropic paste
Mix Ratio by Weight10:2.5
Number of ComponentsTwo
Thixotropic Index4.8
Weight Loss0.26%200°C
 0.56%250°C

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PPOXYT019 / 141057

Chemically Resistant adhesives

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