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Master Bond adhesives

Materion Beryllium Copper Alloy 25 Plate & Rolled Bar; H (TD04) Temper; over 25 to 51 mm Thickness (UNS C17200)
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy
Material Notes: Treatment required for max strength: as supplied

Tabulated properties apply to products after age hardening. Information supplied by Brush Wellman.

Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011.
Key Words: ASTM B-194, AMS 4534
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 8.36 g/cc0.302 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell B 88 - 10288 - 102
Tensile Strength, Ultimate 580 - 830 MPa84100 - 120000 psi
Tensile Strength, Yield 510 - 730 MPa74000 - 106000 psi
Elongation at Break 8.0 - 20 %8.0 - 20 %
Modulus of Elasticity 131 GPa19000 ksi
Machinability 20 %20 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000910 - 0.0000115 ohm-cm0.00000910 - 0.0000115 ohm-cm15-19% IACS Conductivity
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.0 µm/m-°C
@Temperature 20.0 - 200 °C		9.44 µin/in-°F
@Temperature 68.0 - 392 °F
Thermal Conductivity 105 W/m-K729 BTU-in/hr-ft²-°F
Melting Point 870 - 980 °C1600 - 1800 °F
Solidus 870 °C1600 °F
Liquidus 980 °C1800 °F
 
Component Elements PropertiesMetricEnglishComments
Beryllium, Be 1.8 - 2.0 %1.8 - 2.0 %
Co + Ni >= 0.20 %>= 0.20 %
Co + Ni + Fe <= 0.60 %<= 0.60 %
Copper, Cu 98 %98 %as balance

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NBB542 / 15209




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