Rogers Corporation Ultralam® 3908 Liquid Crystalline Polymer Circuit Material

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Rogers Corporation Ultralam® 3908 Liquid Crystalline Polymer Circuit Material
Categories:	Polymer
Material Notes:	ULTRALAM® 3908 bondply is used as a bonding medium between copper and the dielectric material. This product was developed specifically for multi-layer substrate constructions. This adhesiveless film is well suited for high speed and high frequency applications in telecommunication network equipment, high-speed computer data links and other high performance applications. Features and Benefits: Excellent electrical properties - Stable dielectric constant for minimal cross talk between signal layers, allows use of thinner bonding film with very minimal signal loss Low modulus - Bends easily for flex applications, offers design flexibility and minimizes space requirements Extremely low moisture absorption - maintains stable electrical, mechanical and dimensional properties Flame resistant - halogen-free, UL94VTM/0 (meets requirements for consumer products) Typical Applications: All LCP flex interconnections - high speed switches and routers, Backplane-to-backplane, Data links, Card-to-card Hybrid substrates - Handheld and RF devices Information provided by Rogers Corporation.
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Physical Properties	Metric	English	Comments

Water Absorption	0.040 % @Time 86400 sec	0.040 % @Time 24.0 hour	IPC 2.6.2
Thickness	25.4 - 50.8 microns	1.00 - 2.00 mil	10% tolerance for variation

Mechanical Properties	Metric	English	Comments
Tensile Strength	214 MPa	31000 psi	IPC 2.4.19
Tensile Modulus	2.45 GPa	355 ksi	IPC 2.4.19
Tear Strength Test	>= 1.4	>= 1.4	kg; IPC 2.4.16

Electrical Properties	Metric	English	Comments
Volume Resistivity	2.60e+20 ohm-cm	2.60e+20 ohm-cm	IPC 2.5.17.1
Surface Resistance	1.20e+18 ohm	1.20e+18 ohm	IPC 2.5.17.1
Dielectric Constant	2.9 @Frequency 1e+10 Hz	2.9 @Frequency 1e+10 Hz	IPC-TM-650 2.5.5.5.1
Dielectric Strength	118 kV/mm	3000 kV/in	ASTM D149
Dissipation Factor	0.0025 @Frequency 1e+10 Hz	0.0025 @Frequency 1e+10 Hz	IPC-TM-650 2.5.5.5.1

Thermal Properties	Metric	English	Comments
CTE, linear	17.0 µm/m-°C @Temperature 30.0 - 150 °C	9.44 µin/in-°F @Temperature 86.0 - 302 °F	X-, Y-Direction; IPC 2.4.41.3
	150 µm/m-°C @Temperature 30.0 - 150 °C	83.3 µin/in-°F @Temperature 86.0 - 302 °F	Z-Direction; IPC 2.4.41.3
Melting Point	280 °C	536 °F	DSC
Maximum Service Temperature, Air	>= 240 °C	>= 464 °F	UL RTI
UL RTI, Mechanical without Impact	190 °C	374 °F
Flammability, UL94	V-0	V-0

Descriptive Properties
Chemical Resistance	98.7 percent		IPC 2.3.4.2
Coefficient of Hygroscopic Expansion	4 ppm/%RH		60°C
Dimensional Stability	< 0.1%		MD; IPC 2.2.4 method B
	< 0.1%		TD; IPC 2.2.4 method B
Solder Float	pass		IPC 2.4.13, Method B; 288°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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