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Chemically Resistant adhesives

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Overview of materials for Epoxy, Thermally Conductive
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Thermally Conductive". Each property range of values reported is minimum and maximum values of appropriate MatWeb entries. The comments report the average value, and number of data points used to calculate the average. The values are not necessarily typical of any specific grade, especially less common values and those that can be most affected by additives or processing methods.

Vendors: Master Bond is a leading manufacturer of high performance epoxy adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Our epoxies include one and two part formulations that can be cured at room temperature, with heat or exposure to UV light. Special formulations feature high electrical and/or thermal conductivity and wide service temperature ranges. Visit www.masterbond.com.

Kohesi Bond is a pioneer in manufacturing over 300 grades of custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. Our first-rate adhesives are tailor-fitted to meet your exact specifications and offer superior strength and performance in your application. Learn more about Kohesi Bond’s industry-ready products at kohesibond.com.

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Physical PropertiesOriginal ValueComments
Density 0.670 - 4.45 g/ccAverage value: 1.82 g/cc Grade Count:96
Water Absorption 0.100 - 0.500 %Average value: 0.172 % Grade Count:9
Particle Size 20.0 - 500 µmAverage value: 56.3 µm Grade Count:48
Viscosity 10.0 - 819000 cPAverage value: 82600 cP Grade Count:115
 800 - 120000 cP
@Temperature 40.0 - 100 °C
Average value: 13500 cP Grade Count:8
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 15.0 - 85.0Average value: 53.2 Grade Count:6
Hardness, Shore D 15.0 - 100Average value: 82.6 Grade Count:112
 24.0 - 28.0
@Temperature 100 - 149 °C
Average value: 52.4 Grade Count:4
Tensile Strength, Ultimate 0.820 - 552 MPaAverage value: 45.1 MPa Grade Count:43
Elongation at Break 0.200 - 70.0 %Average value: 16.4 % Grade Count:13
Modulus of Elasticity 0.0179 - 20.0 GPaAverage value: 5.48 GPa Grade Count:81
 2.362 - 4.25 GPa
@Temperature 0.000 - 100 °C
Average value: 3.31 GPa Grade Count:1
Flexural Yield Strength 180 - 579 MPaAverage value: 404 MPa Grade Count:4
Compressive Yield Strength 68.9 - 207 MPaAverage value: 151 MPa Grade Count:22
Shear Strength 3.20 - 53.8 MPaAverage value: 20.0 MPa Grade Count:50
Adhesive Bond Strength 1.72 - 27.6 MPaAverage value: 11.8 MPa Grade Count:47
Izod Impact, Notched 0.160 - 53.4 J/cmAverage value: 17.9 J/cm Grade Count:3
Peel Strength 0.789 - 10.5 kN/mAverage value: 2.51 kN/m Grade Count:15
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00100 - 1.00e+16 ohm-cmAverage value: 6.27e+14 ohm-cm Grade Count:103
 2.00e+13 - 3.20e+13 ohm-cm
@Temperature 75.0 - 75.0 °C
Average value: 2.90e+13 ohm-cm Grade Count:4
Surface Resistance 1.50e+12 - 4.40e+14 ohmAverage value: 8.57e+13 ohm Grade Count:5
Dielectric Constant 3.12 - 7.80Average value: 4.81 Grade Count:95
Dielectric Strength 7.40 - 78.7 kV/mmAverage value: 21.4 kV/mm Grade Count:41
Dissipation Factor 0.00100 - 0.146Average value: 0.0120 Grade Count:60
Arc Resistance 120 - 193 secAverage value: 154 sec Grade Count:3
 
Thermal PropertiesOriginal ValueComments
CTE, linear 10.4 - 239 µm/m-°CAverage value: 61.0 µm/m-°C Grade Count:100
CTE, linear, Transverse to Flow 22.0 - 246 µm/m-°CAverage value: 101 µm/m-°C Grade Count:6
 175 - 192 µm/m-°C
@Temperature >=160 °C
Average value: 184 µm/m-°C Grade Count:2
Thermal Conductivity 0.100 - 17.0 W/m-KAverage value: 1.54 W/m-K Grade Count:120
 0.800 - 1.50 W/m-K
@Temperature 80.0 - 121 °C
Average value: 1.15 W/m-K Grade Count:2
Maximum Service Temperature, Air 100 - 375 °CAverage value: 220 °C Grade Count:121
Minimum Service Temperature, Air -269 - -20.0 °CAverage value: -66.0 °C Grade Count:116
Glass Transition Temp, Tg -27.0 - 215 °CAverage value: 91.3 °C Grade Count:79
Decomposition Temperature 291 - 486 °CAverage value: 386 °C Grade Count:53
Flammability, UL94 V-0Grade Count:6
 
Processing PropertiesOriginal ValueComments
Cure Time 8.00 - 10100 minAverage value: 2280 min Grade Count:53
 1.00 - 1440 min
@Temperature 45.0 - 204 °C
Average value: 118 min Grade Count:116
Pot Life 5.00 - 130000 minAverage value: 7560 min Grade Count:95
 30.0 - 30.0 min
@Temperature 60.0 - 80.0 °C
Average value: 105 min Grade Count:4

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Overview of materials for Epoxy, Electrically Conductive
Overview of materials for Epoxy, High Temperature
Overview of materials for Epoxy Molding Compound
Overview of materials for Epoxy, Cast, Unreinforced
Overview of materials for Epoxy Cure Resin

O1726 / 120755

Chemically Resistant adhesives

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