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Master Bond adhesives

Copper Alloy, UNS C70310, TM02 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Mill-hardened Temper, TM - 1/2 Hard

Fabrication Properties: Excellent Suitability – Capacity for Being Cold Worked, Capacity for Being Hot Formed; Good Suitability – Soldering, Brazing, Oxyacetylene Welding, Gas Shielded Arc Welding, Coated Metal Arc Welding, Spot Weld, Seam Weld, Butt Weld

Common Fabrication Processes: Forming and Bending; Stamping

Typical uses: Connectors; Contacts; Switches and Relays; Terminals

Applicable Specifications: Sheet & Strip – ASTM B422/B422M; Strip – ASTM B888/B88M

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Physical PropertiesMetricEnglishComments
Density 8.83 g/cc0.319 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength >= 655 MPa>= 95000 psifor Standard
Tensile Strength, Yield >= 586 MPa>= 85000 psi0.2% Offset, for Standard
Elongation at Break 10 %10 %
Tensile Modulus 128 GPa18600 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000450 ohm-cm0.00000450 ohm-cm38% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear 16.9 µm/m-°C
@Temperature 20.0 - 100 °C
9.40 µin/in-°F
@Temperature 68.0 - 212 °F
Melting Point 1069 - 1090 °C1957 - 1994 °F
Solidus 1069 °C1957 °F
Liquidus 1090 °C1994 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 91.2 - 98.9 %91.2 - 98.9 %As Balance
Iron, Fe <= 0.10 %<= 0.10 %
Lead, Pb <= 0.050 %<= 0.050 %
Magnesium, Mg <= 0.10 %<= 0.10 %
Nickel, Ni 1.0 - 4.0 %1.0 - 4.0 %
Phosphorus, P <= 0.050 %<= 0.050 %
Silicon, Si 0.080 - 1.0 %0.080 - 1.0 %
Silver, Ag 0.020 - 0.50 %0.020 - 0.50 %
Tin, Sn <= 1.0 %<= 1.0 %
Zinc, Zn <= 2.0 %<= 2.0 %
Zirconium, Zr 0.0050 - 0.050 %0.0050 - 0.050 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC70310x1 / 292421

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