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Metal adhesives

Henkel Loctite® ABLESTIK 84-1LMIS Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Silver

Product Benefits:

  • Electrically conductive
  • Solvent-free formulation
  • Long work life
Cure: Heat cure

Application: Die attach

Filler Type: Silver

LOCTITE ABLESTIK 84-1LMIS adhesive is designed for semiconductor packaging applications. This adhesive is ideal for application by dispensing or stamping.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Brookfield Viscosity 17000 cP17000 cPUncured, Speed 5 rpm
 
Mechanical PropertiesMetricEnglishComments
Shear Strength 11.0 MPa
@Temperature 200 °C
1600 psi
@Temperature 392 °F
Die, Al to Al
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 0.00020 ohm-cm0.00020 ohm-cmCured
 
Thermal PropertiesMetricEnglishComments
CTE, linear 46.0 µm/m-°C25.6 µin/in-°FCured, Below Tg
 246 µm/m-°C137 µin/in-°FCured, Above Tg
Thermal Conductivity 1.50 W/m-K10.4 BTU-in/hr-ft²-°FCured
Glass Transition Temp, Tg 127 °C261 °FCured, TMA
 
Processing PropertiesMetricEnglishComments
Cure Time  30.0 min
@Temperature 200 °C
0.500 hour
@Temperature 392 °F
Alternate Cure Schedule
 60.0 min
@Temperature 175 °C
1.00 hour
@Temperature 347 °F
Shelf Life 12.0 Month
@Temperature -40.0 °C
12.0 Month
@Temperature -40.0 °F
Uncured, from date of manufacture
 
Descriptive Properties
Extractable Ionic Content (ppm)<10Cured, Chloride (Cl-)
 <10Cured, Sodium (Na+)
 <5Cured, Potassium (K+)
Shear Strength5.3 kg-f2 X 2 mm (80 x 80 mil) Au die on Ag/Cu LF
Thixotropic Index4Uncured, 0.5/5 rpm
Water Extract Conductivity15 µmhos/cmCured
Weight Loss (%)0.15Cured @ 300ºC, TGA

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PLOCT5003 / 255214

Metal adhesives

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