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Master Bond adhesives

Copper Alloy, UNS C44710, H01 Temper, Strip & Plate
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 1/4 Hard

Fabrication Properties: Excellent Suitability – Soldering, Brazing; Good Suitability –Oxyacetylene Welding, Gas Shielded Arc Welding, Spot Weld, Butt Weld, Capacity for Being Cold Worked; Fair Suitability – Capacity for Being Hot Formed

Typical Uses: Handrails; Trim; Connectors, automotive; Springs; Terminals, automotive

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 8.58 g/cc0.310 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Vickers 140140
Tensile Strength 421 - 517 MPa61000 - 75000 psi
 469 MPa68000 psiTypical
Tensile Strength, Yield 372 MPa54000 psi0.2% Offset, Typical
 303 - 448 MPa44000 - 65000 psi0.2% Offset
Elongation at Break >= 20 %>= 20 %
Tensile Modulus 115 GPa16700 ksi
Modulus of Rigidity 43.29 GPa6278 ksiCalculated
Poissons Ratio 0.330.33
Machinability 30 %30 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000860 ohm-cm0.00000860 ohm-cm20% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear  19.8 µm/m-°C
@Temperature 20.0 - 100 °C
11.0 µin/in-°F
@Temperature 68.0 - 212 °F
 19.8 µm/m-°C
@Temperature 20.0 - 200 °C
11.0 µin/in-°F
@Temperature 68.0 - 392 °F
 19.8 µm/m-°C
@Temperature 20.0 - 300 °C
11.0 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.377 J/g-°C0.0900 BTU/lb-°F
Thermal Conductivity 7.49 W/m-K52.0 BTU-in/hr-ft²-°F
Melting Point 927 - 966 °C1700 - 1770 °F
Solidus 927 °C1700 °F
Liquidus 966 °C1770 °F
Annealing Point >= 499 °C>= 930 °F
 
Processing PropertiesMetricEnglishComments
Processing Temperature 299 °C570 °FStress Relief
Hot-Working Temperature >= 849 °C>= 1560 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 65.5 - 71.5 %65.5 - 71.5 %
Iron, Fe <= 0.030 %<= 0.030 %
Lead, Pb <= 0.050 %<= 0.050 %
Nickel, Ni 1.5 - 2.5 %1.5 - 2.5 %
Phosphorus, P 0.0050 - 0.050 %0.0050 - 0.050 %
Tin, Sn 0.20 - 0.80 %0.20 - 0.80 %
Zinc, Zn 25.1 - 32.8 %25.1 - 32.8 %As Balance

References for this datasheet.

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MC44710x5 / 292006

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