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Master Bond adhesives

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Asahi Kasei Xyron™ X1561 PPE/PS, High Stiffness, Low Warp Chassis
Categories: Polymer; Thermoplastic; Polyphenylene Ether/PPO; Polystyrene (PS); Polystyrene + Polyphenylene Ether, Unreinforced

Material Notes: Excellent heat resistance, flame retardance, dimensional stability, and mechanical properties. Applications: Automotive parts, electrical & electronic parts, industrial parts.

Information provided by Asahi Kasei Corp.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.15 g/ccISO 1183
Filler Content 10 %
Water Absorption 0.060 %
@Time 86400 sec
Immersion; ISO 62
Linear Mold Shrinkage 0.0030 - 0.0050 cm/cm150X150X2 mm; Asahi Kasei
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 73.0 MPa50% RH; ISO 527
Elongation at Break 2.0 %50%RH; ISO 527
Flexural Strength 105 MPa50% RH; ISO 178
Flexural Modulus 3900 MPa50% RH; ISO 178
Charpy Impact, Notched 4.00 kJ/m²
@Thickness 4.00 mm
ISO 179
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+16 ohm-cm50%RH; IEC 60093
Surface Resistance 1.00e+16 ohm50% RH; IEC 60093
Dielectric Constant 3.0
@Frequency 1e+6 Hz
IEC 60250
 3.1
@Frequency 100 Hz
IEC 60250
Dissipation Factor 0.0030
@Frequency 100 Hz
IEC 60250
 0.0050
@Frequency 1e+6 Hz
IEC 60250
 
Thermal PropertiesOriginal ValueComments
CTE, linear 60.0 µm/m-°C
@Temperature -30.0 - 65.0 °C
ISO 11359
Deflection Temperature at 1.8 MPa (264 psi) 97.0 °CISO 75-1
Flammability, UL94 V-0
@Thickness 1.60 mm
 5VA
@Thickness 2.50 mm
 
Processing PropertiesOriginal ValueComments
Melt Temperature 240 - 280 °CResin Temperature
Mold Temperature 60.0 - 90.0 °C
Drying Temperature 90.0 - 100 °C
@Time 7200 - 14400 sec

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PASAHI8213 / 221240

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