| Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also available in a frozen syringe. Advantages & Application Notes: - Designed specifically to meet the requirements pertaining to the MIL-STD 883/Test Method 5011 for military hybrids.
- Can be considered a lower stress, and lower cure temperature alternative to EPO-TEK® H35-175MP.
- Compliant material; eliminates cracking when bonding large components or substrates.
- Excellent adhesion to ceramic, Si, Au, kovar, Au/kovar and AgPd.
- May also be used on lead-frames and die-paddles compatible with JEDEC plastic IC packaging.
- Adaptable to conventional processing methods such as automatic dispensing or screen printing.
- Passes NASA low outgassing standard ASTM E595 with proper cure
Information Provided by Epoxy Technology |
