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Master Bond adhesives

Copper Alloy, UNS C70330, H04 Temper, Strip
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Hard

Fabrication Properties: Good Suitability – Soldering, Brazing, Oxyacetylene Welding, Gas Shielded Arc Welding, Coated Metal Arc Welding, Capacity for Being Cold Worked, Capacity for Being Hot Formed; Fair Suitability – Spot Weld, Seam Weld, Butt Weld

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Physical PropertiesMetricEnglishComments
Density 8.80 g/cc0.318 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Vickers >= 210
@Load 3.00 kg
>= 210
@Load 6.62 lb
Tensile Strength 793 MPa115000 psiTypical
 745 - 855 MPa108000 - 124000 psi
Tensile Strength, Yield 724 MPa105000 psi0.2% Offset, Typical
 676 - 786 MPa98000 - 114000 psi0.2% Offset
Elongation at Break >= 4.0 %>= 4.0 %
Tensile Modulus 131 GPa19000 ksi
Modulus of Rigidity 48.9 GPa7090 ksiCalculated
Poissons Ratio 0.340.34
Machinability 20 %20 %
Forgeability 70 %70 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000330 ohm-cm0.00000330 ohm-cm52% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.6 µm/m-°C
@Temperature 20.0 - 300 °C
9.80 µin/in-°F
@Temperature 68.0 - 572 °F
Thermal Conductivity 16.6 W/m-K115 BTU-in/hr-ft²-°F
Melting Point 1075 - 1097 °C1967 - 2007 °F
Solidus 1075 °C1967 °F
Liquidus 1097 °C2007 °F
 
Component Elements PropertiesMetricEnglishComments
Chromium, Cr 0.050 - 0.20 %0.050 - 0.20 %
Cobalt, Co 0.50 - 1.5 %0.50 - 1.5 %
Copper, Cu 95.6 - 98.6 %95.6 - 98.6 %As Balance
Nickel, Ni 0.50 - 1.5 %0.50 - 1.5 %
Phosphorus, P <= 0.20 %<= 0.20 %
Silicon, Si 0.40 - 0.80 %0.40 - 0.80 %
Zinc, Zn <= 0.20 %<= 0.20 %

References for this datasheet.

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MC70330x2 / 292435

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