Cookson Group Plaskon® SMT-B-1LAS Low Alpha Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1LAS Low Alpha Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. An all-spherical filler system ensures outstanding moldability both with automated and conventional molding systems. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid array applications. Features: Minimal warpage Low stress Low viscosity Low alpha particle content Outstanding high temperature flexural strength Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	1.88 g/cc
Viscosity	4500 cP @Temperature 175 °C	Automatic orifice Viscosity
Linear Mold Shrinkage	0.00050 cm/cm
Spiral Flow	140 cm	at 177°C and 1000 psi
Ash	77 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	75	Cull hot, 90 sec @ 175°C
Flexural Strength	15650 psi
	6400.5 psi @Temperature 215 °C
Flexural Modulus	1.991e+6 psi
	853400 psi @Temperature 215 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+15 ohm-cm @Temperature 22.0 °C
Dielectric Constant	3.7 @Frequency 1000 Hz
Dielectric Strength	400 V/mil
Dissipation Factor	0.0021 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	16.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	68.0 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	220 °C
Flammability, UL94	V-0 @Thickness 3.17 mm
Oxygen Index	34 %

Processing Properties	Original Value	Comments
Mold Temperature	170 - 185 °C
Back Pressure	750 - 1000 psi
Cure Time	4.00 - 5.00 hour @Temperature 175 °C	Post mold
	120 - 180 sec @Temperature 177 °C
Gel Time	0.250 min	Ram follower, at 177°C and 1000 psi
Shelf Life	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Alpha Particle Count	<0.001 counts/cm2/hr
Hydrolyzable Cl	<1 ppm
Preheat Temperature	90-100°C

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PPLASK006 / 56296

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