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Ensinger PEI

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CHT SE2011 Silicone elastomer
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: This is a self-bonding 2-component, silicone elastomer system specially designed for electronic potting and encapsulation applications. It offers good protection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. It can be employed in areas where low flammability is a prerequisite. The cured elastomer can be repaired. The component parts have relatively low viscosities and are readily mixed either by hand or machine. This silicone elastomer has the benefit of developing chemical adhesion to a variety of substrates and is compatible with many sensitive substrates including copper, brass, steel, aluminium, FR4, and plastics making this an ideal option where fast curing and adhesion are needed without the use of a primer.

Key Features

  • Adhesive at room temperature
  • Fast curing at room temperature
  • Low viscosity
  • UL recognised in file No. E334038
Application: Junction box potting for solar / photovoltaic cells

Cured Product: 7 days at 23+/-2°C and 50+/-5% humidity

Information provided by CHT Group

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 0.830 g/ccB; BS ISO 2781
 1.05 g/ccA; BS ISO 2781
 1.08 g/ccCured Product; BS ISO 2781
Brookfield Viscosity 100 cPB
 4000 cPMixed
 4400 cPA
Linear Mold Shrinkage 0.028 cm/cm
Storage Temperature <= 40.0 °C
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 23ASTM D2240-95
Tensile Strength 131 psi
Elongation at Break 270 %ISO 37
Tensile Modulus 42.0 psiYoung's
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.09e+14 ohm-cmASTM D-257
Dielectric Constant 3.28ASTM D-150
Dielectric Strength 594 V/milASTM D-149
Dissipation Factor 0.029ASTM D-150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 279 µm/m-°C
Thermal Conductivity 0.200 W/m-K
Maximum Service Temperature, Air 220 °C
Minimum Service Temperature, Air -50.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 hourDe-mould Time / Full Cure
Pot Life 20.0 min
Shelf Life 6.00 Month
 
Descriptive Properties
AppearanceCondensation
ColorBlack
Mix Ratio10:1By Weight
RheologyLiquid
Self BondingYes
Volume Coefficient of Thermal Expansion837 ppm/°C

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PCHTSIL062 / 314545

Proto3000 – 3D Engineering Solutions

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