AIM SAC305 Lead-Free Solder for Photonic Packaging

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AIM SAC305 Lead-Free Solder for Photonic Packaging
Categories:	Metal; Nonferrous Metal; Solder/Braze Alloy
Material Notes:	This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. Uses include: Fiber to Ferrule Soldering Laser Die Attach Hermetic Packaging & Sealing Wetting & Sealing Laser Optics Thermal Management Information provided by AIM Specialty Materials.
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Physical Properties	Original Value	Comments

Density	7.38 g/cc

Mechanical Properties	Original Value	Comments
Tensile Strength, Ultimate	40000 psi

Thermal Properties	Original Value	Comments
CTE, linear	40.0 µm/m-°C @Temperature 20.0 °C
Melting Point	217 - 218 °C
Solidus	217 °C
Liquidus	218 °C

Processing Properties	Original Value	Comments
Processing Temperature	265 - 300 °C	Wave soldering pot temperature

Component Elements Properties	Original Value	Comments
Aluminum, Al	<= 0.003 %	typical impurity level
Antimony, Sb	<= 0.1 %	typical impurity level
Arsenic, As	<= 0.01 %	typical impurity level
Bismuth, Bi	<= 0.01 %	typical impurity level
Cadmium, Cd	<= 0.001 %	typical impurity level
Copper, Cu	0.40 - 0.60 %
Indium, In	<= 0.10 %	typical impurity level
Iron, Fe	<= 0.01 %	typical impurity level
Lead, Pb	<= 0.05 %	typical impurity level
Nickel, Ni	<= 0.003 %	typical impurity level
Silver, Ag	2.8 - 3.2 %
Tin, Sn	96.2 - 96.8 %	as balance
Zinc, Zn	<= 0.001 %	typical impurity level

Descriptive Properties
Creep Resistance	High

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NAIMSP11 / 14592

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