Epoxy Technology EPO-TEK® GE116 Electrically and Thermally Insulating Epoxy

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Epoxy Technology EPO-TEK® GE116 Electrically and Thermally Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Material Description: A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, medical, automotive, and scientific/OEM. It is a red color version of EPO-TEK® 115-SMT. Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	1.15 g/cc
Particle Size	<= 20 µm
Viscosity	200000 - 300000 cP @Temperature 23.0 °C	1 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80
Tensile Modulus	439000 psi	Storage
Shear Strength	1568 psi	Lap
	>= 1700 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 7.00e+13 ohm-cm
Dielectric Constant	3.48 @Frequency 1000 Hz
Dissipation Factor	0.0070 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	41.0 µm/m-°C	Below Tg
	218 µm/m-°C	Above Tg
Maximum Service Temperature, Air	175 °C	Continuous
	275 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 65.0 °C	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	344 °C	Degradation Temperature

Processing Properties	Original Value	Comments
Cure Time	>= 5.00 min @Temperature 150 °C
	>= 15.0 min @Temperature 120 °C
Pot Life	40320 min
Shelf Life	1.00 Month @Temperature 23.0 °C
	12.0 Month @Temperature -40.0 °C

Descriptive Properties
Color	Red	before cure
Consistency	Smooth Thixotropic paste
Number of Components	Single
Weight Loss	0.27%	200°C
	1.12%	250°C
	2.96%	300°C

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