Dow SiLK™ I 550 Semiconductor Dielectric Resin

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Dow SiLK™ I 550 Semiconductor Dielectric Resin (discontinued **)
Categories:	Polymer
Material Notes:	SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with standard IC processing tools in todays fabrications. SiLK™ I 550 is fluorine-free, thus is compatible with Ti and Ta barrier materials. Information provided by Dow
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Physical Properties	Original Value	Comments

Moisture Absorption	0.24 %	80% R.H.
Thickness	0.550 microns	3000 rpm
	0.475 - 0.676 microns	2000-4000 rpm

Mechanical Properties	Original Value	Comments
Tensile Strength, Ultimate	89.0 MPa
Tensile Strength, Yield	60.0 MPa
Tensile Modulus	2.45 GPa

Electrical Properties	Original Value	Comments
Dielectric Constant	2.6 @Frequency 100000 Hz
Dielectric Strength	>= 400 kV/mm

Thermal Properties	Original Value	Comments
CTE, linear	62.0 µm/m-°C @Temperature 50.0 - 150 °C
Thermal Conductivity	0.190 W/m-K
	0.230 W/m-K @Temperature 125 °C
Glass Transition Temp, Tg	>= 490 °C
Decomposition Temperature	450 °C	1% weight loss per hour

Optical Properties	Original Value	Comments
Refractive Index	1.63

**
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PDOW1067 / 30271

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